| Allicdata Part #: | ATS-13A-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-13A-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat Sinks are an integral part of electronics and other devices, where the proper functioning of those devices depend on the efficient dissipation of heat. The ATS-13A-10-C1-R0 thermal heat sink is a high-performance component specifically designed to dissipate thermal energy generated by electronic components.
The ATS-13A-10-C1-R0 is a cost-effective and reliable thermal heat sink that features a finned aluminum construction. The design of the fins and the aluminum-alloy used in the ATS-13A-10-C1-R0 allows for maximum heat dissipation. The clamshell neck design minimizes the pressure on components in thermal applications, ensuring reliable and secure connections.
The ATS-13A-10-C1-R0 is widely used in various applications, ranging from automotive and industrial electronics to telecommunications and computers. This thermal heat sink is suitable for use with a wide range of components, including CPUs, GPUs, memory, power devices, and other high-power electronic components. It is also well suited to working in the harshest environmental conditions.
The ATS-13A-10-C1-R0 features a mountable base, making installation of the heat sink easy and efficient. The thermal heat sink can be mounted on all types of circuit boards and chassis for easy installation. The ATS-13A-10-C1-R0 also features a universal mounting hole pattern, making it suitable for a wide range of applications.
This thermal heat sink utilizes a natural convection-based cooling system, which is ideal for installations with limited airflow. This cooling method works by using the natural rise of the heated air generated by the components to efficiently cool them. This process improves the longevity and performance of the components and prevents them from overheating. Furthermore, the natural convection-based cooling system ensures very quiet operation, making the ATS-13A-10-C1-R0 an ideal choice for noise-sensitive environments.
The ATS-13A-10-C1-R0 is also equipped with an efficient fin design, providing a large surface area to dissipate the heat generated by the components. The aluminum alloy fins also feature a high thermal conductivity, allowing the heat generated to transfer quickly and effectively to the surrounding air. This ensures that all components remain cool and well within their tolerance levels.
The ATS-13A-10-C1-R0 is a reliable and cost-effective thermal heat sink that is suitable for a wide range of applications. It is engineered to provide superior cooling performance and a long-lasting, reliable life. The ATS-13A-10-C1-R0 is also equipped with a mountable base, a universal mounting hole pattern, and an efficient fin design, all of which make installation and operation of the heat sink easy and efficient.
The specific data is subject to PDF, and the above content is for reference