| Allicdata Part #: | ATS21693-ND |
| Manufacturer Part#: |
ATS-13A-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks technology is a widely used in electronic applications. The ATS-13A-131-C2-R0 is one example of a Thermal - Heat Sink that is specifically designed for a particular application field and provides efficient heat dissipation.
This Thermal - Heat Sink is a lightweight heat spreader designed for use in similar applications. It is constructed from a combination of aluminum and copper materials, providing the perfect combination of heat transfer and durability. The ATS-13A-131-C2-R0 is useful in applications that require excellent cooling performance such as CPU and Memory chipsets, as well as power supplies.
The ATS-13A-131-C2-R0 is designed to dissipate heat rapidly and dissipate it evenly across the module. This is due to the carefully designed aluminum core which provides a good amount of surface area for heat dissipation. The copper layer is applied as a secondary layer of thermal protection, which improves the performance of the heat sink in demanding environments. It also provides the necessary protection against shocks and impacts, improving the reliability of the ATS-13A-131-C2-R0 in a wide range of applications.
The ATS-13A-131-C2-R0 features a pre-applied compound and a long life soldering process. This ensures that the thermal properties of the ATS-13A-131-C2-R0 will remain reliable and consistent over the long term. The compound provides an extra layer of protection and helps to reduce the thermal resistance of the module.
The ATS-13A-131-C2-R0 is designed to be easy to install and its application field is quite wide. This heat sink is suitable for use in many different types of PCBs, including ceramic, plastic, and wet PCBs. It can also be used in high-power applications that generate a large amount of heat. This type of heat sink is also compatible with other cooling devices, such as fans or liquid cooling systems.
The ATS-13A-131-C2-R0 working principle is based on the same principles as other Thermal - Heat Sinks. The main concept is that heat from the electronic device is dissipated from the Thermal - Heat Sink’s surface, which is then transferred away from the electronic device. In order for the ATS-13A-131-C2-R0 to work effectively, the heat from the electronic device must be able to easily flow through its surface.
The ATS-13A-131-C2-R0 also has a wide variety of features that make it an excellent choice for different applications. It is designed to be efficient and reliable in high-power applications which require high heat dissipation ability. The ATS-13A-131-C2-R0 also provides an excellent thermal profile, which ensures that all the components under its surface will remain cool, even when exposed to high temperatures.
In conclusion, the ATS-13A-131-C2-R0 Thermal - Heat Sink is designed to provide an excellent heat dissipation performance in a wide range of applications. It is designed with a combination of aluminum and copper materials, which makes it highly durable and reliable. Its easy installation and high efficiency make it an excellent option for all types of electronic devices.
The specific data is subject to PDF, and the above content is for reference