ATS-13A-138-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.18°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-13A-138-C2-R0 (short for ATS) is a widely used thermal - heat sink. It has many applications in various sectors such as electronics, industrial, automotive, and aerospace. Generally, it is used as a component in a larger system such as computing systems, communication systems, and power systems. In order to maximize the performance of the system, the thermal - heat sink must be designed and manufactured according to the specific system needs. If ATS is properly applied, it can greatly improve the system’s safety, stability, and overall efficiency.

Application Field

The ATS-13A-138-C2-R0 has a wide range of applications. It is most commonly used in computers, communication, power systems, and automotive areas. In computers, the ATS is required to efficiently dissipate the heat generated from the processor, memory, and other components. It is also used in communication systems to reduce interference between radios, phones, and modems. In addition, it is also commonly used in power systems to maintain the system’s safety and stability. It is also found in automotive applications where it is required to reduce the engine’s temperature and enable it to work at peak performance.

Function and Working Principle

ATS-13A-138-C2-R0 is usually made of copper, aluminum, or stainless steel. It is typically designed to passively dissipate thermal energy from its associated device. It works by transferring the heat generated by the device into the surrounding environment. This is achieved through the use of high conductivity material and finned surfaces which increase the contact area between the heat sink and the surrounding air. By increasing the surface area and using high conductivity materials, more thermal energy can be dissipated through convection.The ATS’s design is also optimized for air flow, so that the amount of air that flows over the finned surface is maximized. This allows for the thermal energy to be dissipated more efficiently. The fins also act as barriers to the air, which reduces noise emission from the fans.

Conclusion

In conclusion, the ATS-13A-138-C2-R0 is a widely used thermal - heat sink with many applications in various industries and sectors. It is typically designed to passively dissipate heat from its associated device by transferring thermal energy into the surrounding environment, which is achieved through the use of high conductivity material and finned surfaces. The ATS’s design is optimized for air flow so that thermal energy can be dissipated more efficiently. Thus, when applied properly, the ATS is an essential component in any thermal design.

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