| Allicdata Part #: | ATS21736-ND |
| Manufacturer Part#: |
ATS-13A-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key component of any electronic device. Heat must be effectively removed from components in order to prevent damage or failure to the device. This is where thermal-heat sinks come into play. ATS-13A-170-C2-R0 is a type of thermal-heat sink designed to increase heat dissipation from an electronic component. The thermal-heat sink is designed to efficiently dissipate large amounts of heat quickly and is suitable for a wide range of applications.
The ATS-13A-170-C2-R0 is a fanless thermal-heat sink solution consisting of an aluminum heatsink, an extruded heatpipe, and a copper heat spreader. The unique combination of materials and design further enhances the ability to quickly dissipate heat from the component, and provides excellent thermal performance with minimal weight and size.
The heatpipe is the primary factor in the thermal performance of the ATS-13A-170-C2-R0. It acts as a conduit, allowing heat to travel quickly away from the heat source and spread out through the entire heatsink. The heat spreader provides even heat distribution, allowing the entire heatsink to be used for cooling. The aluminum heatsink acts as the primary cooling structure, increasing the surface area available for heat dissipation. The combination of these three components greatly increases the cooling capacity of the thermal-heat sink.
This thermal-heat sink is suitable for any electronic application where temperature control is required. It can be used to cool components in a wide range of industries, including telecommunications, aerospace, military, medical, and automotive industries. It can be used to effectively control temperatures in data centers, computers, and other industrial and consumer products. The ATS-13A-170-C2-R0 can provide a reliable, efficient, and cost-effective solution for cooling any electronic application.
The ATS-13A-170-C2-R0 is a reliable and efficient thermal-heat sink solution for any electronic application. It is designed to effectively dissipate large amounts of heat quickly and efficiently, and its lightweight design makes it easy to install and maintain. With its range of applications, the ATS-13A-170-C2-R0 is a great choice for any electronic device requiring temperature control.
The specific data is subject to PDF, and the above content is for reference