ATS-13A-178-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS21744-ND

Manufacturer Part#:

ATS-13A-178-C2-R0

Price: $ 4.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X25MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-178-C2-R0 datasheetATS-13A-178-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.83040
10 +: $ 3.72456
25 +: $ 3.51767
50 +: $ 3.31065
100 +: $ 3.10376
250 +: $ 2.89684
500 +: $ 2.68992
1000 +: $ 2.63820
Stock 1000Can Ship Immediately
$ 4.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a key component in any electronic system. Keeping equipment within safe operating temperatures is essential for both its reliability and longevity. An effective thermal management solution must dissipate unwanted heat efficiently and silently. The ATS-13A-178-C2-R0 is a high-performance Thermal - Heat Sink designed specifically to meet the demanding requirements of extreme temperature environments.

The ATS-13A-178-C2-R0 Thermal - Heat Sink is made of Next Generation Power Core Aluminum, combining the best characteristics of aluminum and carbon fiber. The heat sink is made up of individual finned aluminum elements that are electrically conductive and allow for the rapid dissipation of heat. This powerful combination makes the ATS-13A-178-C2-R0 the perfect thermal management solution for both high and low power applications.

The ATS-13A-178-C2-R0 is designed for maximum performance, providing up to 35% more thermal performance compared to other thermal management solutions on the market. The heat sink also features an integrated fanless active cooling system that can maintain optimal temperatures for the entire system. To further improve cooling performance, the ATS-13A-178-C2-R0 features two separate cooling fins that can be adjusted according to the application, providing up to 20% more cooling within the same footprint.

The ATS-13A-178-C2-R0 also features a number of other useful features such as an anodized aluminum body for extra durability, integrated thermal paste for fast heat transfer, and a patented fin design for increased surface area. Additionally, the ATS-13A-178-C2-R0 is designed to reduce noise and vibration. Its fanless active cooling system runs almost silently and its patented fin design minimizes the buildup of unwanted dust and debris.

The ATS-13A-178-C2-R0 is the perfect thermal management solution for any electronic system. Its powerful combination of anodized aluminum body, integrated thermal paste, and patented fin design allows for greater heat dissipation without noise and vibration. Its fanless active cooling system ensures that temperatures remain within the safe operating range and its adjustable cooling fins further improve performance. The ATS-13A-178-C2-R0 is the perfect choice for any system requiring effective and reliable thermal management.

The specific data is subject to PDF, and the above content is for reference

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