| Allicdata Part #: | ATS21749-ND |
| Manufacturer Part#: |
ATS-13A-182-C2-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-182-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.84930 |
| 10 +: | $ 3.74787 |
| 25 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13A-182-C2-R0 Thermal - Heat Sink is an important part of today’s electronic cooling solution. This device is designed to dissipate heat from modern electronic components, such as CPUs, GPUs and hard drives. It does this by replacing hot air with cool air from outside, allowing for efficient cooling. This technology can also be used in cooling battery packs, power boards and other high-power electronic components.
The main purpose of the ATS-13A-182-C2-R0 Thermal - Heat Sink is to absorb and dissipate the heat generated by the electronic devices mentioned above. This is done by passing air through the heat sink, which acts as a radiator. The hot air is then replaced by cool air from the outside, thus cooling the components effectively. This type of heat sink is also useful in reducing noise levels from the operation of the electronic device.
The ATS-13A-182-C2-R0 Thermal - Heat Sink is composed of aluminum die-cast material, which is a good heat conductor and dissipater. It features a patented thermally-enhanced spreading technology which helps to reduce the thermal resistance between the device and the heat sink. The heat sink’s design also allows for easy installation and removal, and it is compatible with the widely available mounting clips.
The ATS-13A-182-C2-R0 Thermal - Heat Sink works by providing a pathway for the heat generated by electronic components to be transferred and dissipated into the atmosphere. It generally consists of an aluminum base with some type of thermal compound, such as heat spreader paste, applied to the base’s surface. This thermal paste helps to efficiently transfer heat from the component to the base. The thermal compound also helps to ensure that no air pockets or voids are present, allowing for an optimal heat transfer.
The ATS-13A-182-C2-R0 Thermal - Heat Sink is typically mounted to the chassis of the computer or electronic device using a number of mounting screws. Once installed, the sink then absorbs the heat from the electronic components and dissipates it into the atmosphere. This process is known as “heat conduction” and helps the component to remain cool during its operation. The sink also reduces fan noise from the electronic device.
The ATS-13A-182-C2-R0 Thermal - Heat Sink is a great example of how technology is constantly evolving in terms of cooling solutions. This heat sink helps to keep components from becoming too hot, and it greatly reduces the potential of system crashes due to overheating. By using thermal-enhanced spreading technology, this heat sink is able to transfer and dissipate heat quickly and efficiently, making it a great choice for cooling modern electronic components.
The specific data is subject to PDF, and the above content is for reference