| Allicdata Part #: | ATS21756-ND |
| Manufacturer Part#: |
ATS-13A-189-C2-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-189-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.25880 |
| 10 +: | $ 4.14099 |
| 25 +: | $ 3.91079 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential components in almost all electronic applications. Keeping devices at optimal temperatures is important to ensure system reliability and lifespan. Heat sinks are one of the most commonly used thermal management products, and the ATS-13A-189-C2-R0 is a great example. This product is an innovative solution designed to keep temperatures consistently low in applications where heat dissipation is a challenge.The ATS-13A-189-C2-R0 consists of two parts: a main body and a resistance plate. The aluminum alloy main body is composed of multiple fins to increase the surface area for heat dissipation. The resistance plate is made from a highly efficient thermally conductive material, which prevents the spread of generated heat once it is applied. This combination allows the product to achieve superior cooling performance.The ATS-13A-189-C2-R0 has multiple benefits over other solutions. It is specifically designed to provide the highest possible level of thermal conductivity while maintaining a low profile design. This ensures that it is suitable for tight spaces where height is an issue. Additionally, the resistance plate design prevents heat from spreading to nearby components, which is essential for multi-chip applications.The ATS-13A-189-C2-R0 has a wide range of applications. It is suitable for use in a variety of applications, including power electronics, automotive electronics, communication systems, and medical equipment. The heat sink is also applicable to high-power transistors and diodes, making it suitable for a range of high-frequency devices. It has been tested in temperature environments from 0°C to 70°C, and the results show that it consistently provides superior cooling performance.The working principle of the ATS-13A-189-C2-R0 is simple. The heat generated by the device is absorbed by the resistance plate, which prevents it from travelling further. At the same time, the large surface area of the aluminum alloy main body dissipates the heat into the surrounding environment. The highly efficient thermal conductivity of the material ensures that heat from the device is ultimately dissipated into the atmosphere, thereby maintaining a safe and reliable temperature.The ATS-13A-189-C2-R0 is an effective solution for thermal management applications. It ensures that device temperatures remain within a safe range throughout its lifespan, resulting in increased system reliability. The product is highly efficient and cost-effective, making it a popular choice among businesses and professionals in the electronics industry.
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