ATS-13A-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13A-20-C3-R0-ND

Manufacturer Part#:

ATS-13A-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-20-C3-R0 datasheetATS-13A-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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Thermal-Heat Sinks are used to transfer and dissipate heat away from delicate components in a variety of applications. The ATS-13A-20-C3-R0 is a type of Thermal-Heat Sink that has become the preferred choice for a variety of applications in the industry. In this article, the application and working principle of the ATS-13A-20-C3-R0 will be discussed in detail.

The ATS-13A-20-C3-R0 is a type of Thermal-Heat Sink that has been designed with a structure that allows the device to quickly and efficiently dissipate heat away from delicate components. This makes it particularly suitable for applications where there is a high amount of heat dissipation. For example, the ATS-15A-20-C3-R0 is widely used in electrical and electronics applications, including in automotive, industrial, and medical applications. It is also commonly used in telecommunications and computer-related devices.

In terms of the working principle of the ATS-13A-20-C3-R0 Thermal-Heat Sink, heat is conducted away from the component to the sink by a mechanism known as conduction. This is when heat is transmitted from hot to cold areas by the transfer of energy. In this case, the energy is transferred via a medium, such as air or metal. The heat sink structure of the ATS-13A-20-C3-R0 is designed to maximize conduction by providing a large surface area for heat transfer. This ensures that even hot components can be kept cool.

The other important working principle of the ATS-13A-20-C3-R0 Thermal-Heat Sink is convection. This is the transfer of heat from a hot surface to a cooler surface through the movement of air or other fluids. The ATS-13A-20-C3-R0 has a special structure that encourages convection. This helps to quickly remove heat from the components, thus ensuring that they stay cool and operate reliably.

Overall, the ATS-13A-20-C3-R0 Thermal-Heat Sink is a very effective way of dissipating large amounts of heat away from delicate components to ensure their reliable operation in a range of applications. It takes advantage of both conduction and convection to quickly and efficiently transfer and dissipate heat away from components, while also ensuring that they remain cool and operate at optimal performance.

The specific data is subject to PDF, and the above content is for reference

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