ATS-13A-203-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS21772-ND

Manufacturer Part#:

ATS-13A-203-C2-R0

Price: $ 4.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-203-C2-R0 datasheetATS-13A-203-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.83040
10 +: $ 3.72456
25 +: $ 3.51767
50 +: $ 3.31065
100 +: $ 3.10376
250 +: $ 2.89684
500 +: $ 2.68992
1000 +: $ 2.63820
Stock 1000Can Ship Immediately
$ 4.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-13A-203-C2-R0 Application Field and Working Principle

Heat Sinks

Heat sinks are a critical component in the efficient cooling of electronics in many industrial applications. The ATS-13A-203-C2-R0 is a popular type of heat sink that utilizes forced convection cooling, a simple thermal system involving the movement of air for effective heat transfer.

In a typical electronics cooling system, a cooling fan is used to move cool air over the hot components, which facilitates convection current. The ATS-13A-203-C2-R0 employs a unique heat sink design which enhances the cooling efficiency of the fan-forced convection process.

The ATS-13A-203-C2-R0 incorporates a thick metal heat sink whose fins feature an optimized “W” pattern. This “W” pattern ensures that the air passes over a consistent flow pattern as it moves across the heat sink fins, providing increased cooling potential. The pattern also enables a larger surface area to be achieved, thus furthering the cooling potential of the device.

The ATS-13A-203-C2-R0 provides a cost-effective solution to thermal management that is capable of dissipating a large volume of heat and maintaining a low operating temperature. This heat sink is thus suitable for use in a variety of industrial environments, including telecom equipment, personal computers, medical equipment, network servers, and even aerospace applications.

The ATS-13A-203-C2-R0 has a wide range of features to suit any application, including a lightweight and thin design for easy integration, a wide variety of connectors and mounting options, a large contact area, and even a corrosion-resistant surface for increased durability and longevity of use.

By offering enhanced heat dissipation capabilities with a lightweight and corrosion-resistant design, the ATS-13A-203-C2-R0 is an excellent choice for those looking to incorporate efficient thermal management into their applications.

The specific data is subject to PDF, and the above content is for reference

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