ATS-13A-22-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13A-22-C3-R0-ND

Manufacturer Part#:

ATS-13A-22-C3-R0

Price: $ 5.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X12.7MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-22-C3-R0 datasheetATS-13A-22-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.60341
30 +: $ 4.34784
50 +: $ 4.09210
100 +: $ 3.83632
250 +: $ 3.58057
500 +: $ 3.32481
1000 +: $ 3.26087
Stock 1000Can Ship Immediately
$ 5.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.88°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks is an important topic for electronic design. The purpose of a heat sink is to pull heat away from components and dissipate it into the environment. One type of heat sink commonly used is the ATS-13A-22-C3-R0, a thermal management solution used in aerospace, medical, defense, and other industrial applications. This article will discuss the application field and working principle of the ATS-13A-22-C3-R0.

The ATS-13A-22-C3-R0 is a fan-assembled package, consisting of an aluminum heat sink and brushless DC fan. It is designed to work in extreme environments, and it can withstand temperatures ranging from -40°C to 125°C. Additionally, the device has been proven to be effective in cooling systems up to 30W. It can be used in a variety of applications, including LED lighting systems, military and medical equipment, VME boards, as well as embedded computing systems.

The ATS-13A-22-C3-R0 operates on the principle of forced convection. This application of heat transfer is based on the idea of moving air around a heat source in order to reduce the temperature of the heated object. To achieve this, air is moved around the heat source, typically using a fan or blower, which helps to dissipate the heat away from the object. This process of moving air is known as convection, and it is the most effective way to cool most electronic components.

The ATS-13A-22-C3-R0 also utilizes the Bernoulli Principle, which states that a moving fluid has lower static pressure, and higher dynamic pressure. In the case of a heat sink, the fan moves air around the heat sink, and this movement of air causes a decrease in static pressure surrounding the heat sink. This decrease in static pressure results in a suction force, which draws air in through the sides of the heat sink and then exhausts it out the back.

Finally, the ATS-13A-22-C3-R0 also takes advantage of the principle of thermodynamics, specifically the concept of entropy. Entropy is the measure of the degree of disorder in a system, and in the case of a heat sink, it is a measure of the amount of heat that is being dispersed. As the air moves around the heat sink, the temperature of the air changes, and this change in temperature causes an increase in entropy. This increase in entropy causes the air to be cooler and helps to dissipate the heat away from the heat sink.

The ATS-13A-22-C3-R0 is a reliable and efficient heat management solution for extreme environments. It utilizes forced convection, the Bernoulli Principle, and thermodynamics in order to effectively remove heat from electronic components. It is used in aerospace, medical, defense, and other industrial applications, and can handle temperatures ranging from -40°C to 125°C. Additionally, the device has also been proven to be effective in cooling systems up to 30W. By utilizing its principle of forced convection, thermal dynamics, and the Bernoulli Principle, the ATS-13A-22-C3-R0 is an efficient and reliable heat sink for any industrial application.

The specific data is subject to PDF, and the above content is for reference

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