| Allicdata Part #: | ATS-13A-44-C1-R0-ND |
| Manufacturer Part#: |
ATS-13A-44-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-44-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of passive heat exchanger that integrates a thermally conductive metal or graphite component with one or more fins to improve the dissipation of heat away from the component or system. The ATS-13A-44-C1-R0 is a compact heat sink specifically designed for the thermal management of optoelectronics, lighting, embedded electronics, and telecom applications. It features improved performance, low weight, and a high thermal conductivity ratio. This article explores the application field and working principle of the ATS-13A-44-C1-R0.
Applications of ATS-13A-44-C1-R0
The ATS-13A-44-C1-R0 offers excellent thermal performance for a variety of optoelectronic, lighting, embedded electronic, and telecom applications, including high power lighting, LED lighting, telecom systems, switch mode power supplies, motor controllers, automotive electronics, and power electronics. It is also suitable for thermal protection in high-heat environments. Its compact size makes it ideal for application in devices with limited space, such as handheld electronic devices.
The thermal management system of the ATS-13A-44-C1-R0 consists of two parts: a thermally conductive material and a large array of extruded fins. The thermally conductive material is made from aluminum or copper with a thermal conductivity of up to 400 W/mK, which ensures efficient heat dissipation from the component or system. The large array of extruded fins increases the surface area of the heat sink, providing increased cooling performance. The combination of the two components provides excellent thermal performance and reliability.
Working Principle of ATS-13A-44-C1-R0
The working principle of the ATS-13A-44-C1-R0 is based on the heat sink’s structural design and material selection. Heat is transferred from the component or system to the heat sink via conduction. The thermal conductivity of the material ensures efficient heat transfer from the heat source to the heat sink. The fins provide increased surface area for heat dissipation, improving the cooling performance of the heat sink. The increased surface area provides improved airflow and surface area for air to flow across, increasing the rate of heat dissipation.
The ATS-13A-44-C1-R0 is designed to provide an efficient and reliable heat management solution for a variety of applications. Its use of a thermally conductive material and fins ensures efficient heat transfer and high reliability. The improved performance, low weight, and high thermal conductivity ratio make the ATS-13A-44-C1-R0 an excellent choice for thermal management solutions.
The specific data is subject to PDF, and the above content is for reference