ATS-13A-44-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.62°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal heat sinks are designed to dissipate heat generated by electronic components such as processors, voltage regulators and other power-sensitive devices. They are usually composed of several horizontal flat aluminum fins, sometimes entirely enclosed within a mass of finned elements, each fin being connected to a heat-generating component. The fins are connected to a heat spreading plate, which draws heat away from the component and disperses it into the atmosphere. Heat sinks are an integral part of any electronic system where heat is an issue and must be managed properly for the system to operate effectively.The ATS-13A-44-C3-R0 is a state-of-the-art thermal heat sink designed to provide superior heat dissipation in a variety of power-sensitive electronic devices. The ATS-13A-44-C3-R0’s key features include a high-efficiency cooling fan, a low-profile design, and an innovative finned structure that provides maximum heat transfer. In this article, we discuss the ATS-13A-44-C3-R0’s application field and working principle.

Application Field

The ATS-13A-44-C3-R0 has been designed for use in a wide range of application fields. Its ultra-thin design makes it ideal for desktop PCs, electronic gaming machines, consumer electronics, and other devices that require low-profile cooling solutions. The low-profile construction allows it to fit in tight spaces, and its high-efficiency cooling fan helps keep the internal temperature of the device at an ideal level. Additionally, the ATS-13A-44-C3-R0 can be used in high-power applications due to its advanced finned design, allowing it to effectively dissipate higher levels of heat.

Working Principle

The ATS-13A-44-C3-R0 works by drawing heat away from the processor and dispersing it into the atmosphere. The ATS-13A-44-C3-R0 consists of several vertical flat aluminum fins that are connected to a heat spreading plate, which acts as a heat dissipation mechanism. The fins trap the heat generated by the processor, and the heat spreading plate draws the heat away from the component and into the atmosphere. Additionally, the ATS-13A-44-C3-R0 uses a high-efficiency cooling fan to dissipate heat more efficiently.The ATS-13A-44-C3-R0’s fin design has been optimized to maximize heat transfer, allowing it to dissipate more heat than traditional thermal solutions. The fin design also helps to minimize the amount of air that is trapped between the fins, which can reduce cooling efficiency. Additionally, the fins have been designed to be low-profile, allowing the heat sink to fit in tight spaces.

Conclusion

The ATS-13A-44-C3-R0 is a state-of-the-art thermal heat sink designed to provide superior heat dissipation in a variety of power-sensitive electronic devices. Its features include a high-efficiency cooling fan, a low-profile design, and an innovative finned structure that provides maximum heat transfer. The ATS-13A-44-C3-R0 is ideal for desktop PCs, electronic gaming machines, consumer electronics, and other devices that require low-profile, efficient cooling solutions. Its advanced fin design makes it ideal for high-power applications, and its low-profile design allows it to fit in tight spaces.

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