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Thermal - Heat Sinks

Heat sinks are key components used in thermal management systems for managing the temperature of computer chips, integrated circuits, microprocessors, memory modules, and other electronic components. The ATS-13A-55-C2-R0 Thermal - Heat Sink from Avidyne is a high-performing, cost-effective solution for dissipating heat in any application where cooling is required. The heat sink features an internal fin design and uses an advanced thermal transfer material to efficiently draw heat away from the source and disperse it into the surrounding air.

Design

The ATS-13A-55-C2-R0 is designed specifically for the high-temperature environment of computer systems. Its unique fin structure increases surface area, reducing air resistance and allowing for increased cooling efficiency. The fins are made of copper and aluminum and feature a high-efficiency aerodynamic design that enhances the flow of air. This design helps to dissipate heat from the internal components more quickly, while also increasing the overall thermal management system\'s reliability.

Features

The ATS-13A-55-C2-R0 heat sink features an integrated fan design that increases air circulation. This efficient fan design helps maintain a uniform temperature even in high-temperature environments. Additionally, this heat sink comes with an advanced thermal transfer material that provides exceptional thermal conductivity and uniform temperature distribution. This makes the ATS-13A-55-C2-R0 an ideal choice for applications where reliable thermal management is of paramount importance.

Applications

The ATS-13A-55-C2-R0 thermal - heat sink is an ideal solution for a wide range of applications, such as industrial, military, medical, consumer, automotive, and aerospace applications. It is designed for mounting on circuit boards, providing a reliable cooling solution for integrated circuit chips, microprocessors, memory modules, and other components.

Working Principle

The ATS-13A-55-C2-R0 heat sink works by drawing heat away from the source (integrated circuit chips, microprocessors, etc.) and dissipating it into the surrounding air. Its internal fin design helps increase the surface area, reducing airflow resistance while also providing increased cooling efficiency. The fins are constructed of aluminum and copper, providing excellent thermal conductivity. Additionally, it comes with an advanced thermal transfer material that effectively transfers the heat generated from the internal components to the ambient air. This helps maintain a uniform temperature across the entire assembly and allows for efficient cooling of sensitive components.

Conclusion

The ATS-13A-55-C2-R0 Thermal - Heat Sink is an ideal choice for applications where reliable thermal management is of paramount importance. Its advanced cooling design helps to ensure reliable performance in virtual any application environment. It features anaerodynamic fin design to increase airflow, while its advanced thermal transfer material helps to ensure efficient heat transfer. This makes the ATS-13A-55-C2-R0 Thermal - Heat Sink an excellent choice for any application in need of reliable thermal management.

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