| Allicdata Part #: | ATS-13A-66-C1-R0-ND |
| Manufacturer Part#: |
ATS-13A-66-C1-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-66-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.75°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial element in the successful operation of many modern day applications. In order to meet the heat generated by today\'s high-performance CPUs, the ATS-13A-66-C1-R0 was designed as a unique solution for extended temperature ranges and requirements for premium thermal performance. This highly versatile product offers premium thermal management with the ability to house and transfer large amounts of heat while providing reliable operation for many applications.
The ATS-13A-66-C1-R0 utilizes patented Heatpipe/Dual-Fin technology to achieve extended temperature range and superior heat transfer. This device features an external fan housing for superior thermal performance, allowing direct flow to the heat transfer surface eliminating the need for heatsink fans for many applications. It is ideal for applications requiring efficient heat transfer in a limited space.
The ATS-13A-66-C1-R0 also has an excellent airflow design that allows it to act as a thermal bridge between components of different materials, enabling maximum heat transfer between them. This device is constructed using high-grade aluminum which is lightweight and durable while also providing excellent thermal conductivity.
The ATS-13A-66-C1-R0 offers superior performance and reliability in a variety of applications including computer systems, automotive and industrial controls, medical devices, and home entertainment. This product was designed to be highly compatible with a wide range of processors from low power to high wattage and provides extended temperatures range of -40°C to +180°C with superior reliability.
The ATS-13a-66-C1-R0 also offers superior compatibility with most motherboard gaming chipsets, making it the ideal solution for gamers who go above and beyond. Where other heat sinks may falter, this product guarantees reliable performance while keeping the processor safe from excess amounts of heat which could lead to failure.
The ATS-13A-66-C1-R0 works by transferring heat away from its source and into the surrounding air. This process is known as thermal conduction. Heat is generated from the CPU and then transferred through a set of heatpipes and fins that are responsible for the heat transfer. Heatpipes are filled with a liquid medium that allows heat to transfer through them in the form of vapor. This vapor then condenses on the fins and cools off, transferring the heat to the external air surrounding the device.
The ATS-13A-66-C1-R0 heat-sink offers the ultimate in thermal management performance. With superior cooling performance, extended temperature ranges, and superior compatibility, this product is the ideal solution for those who demand the best in cooling solutions. Whether it is for gaming, multimedia solutions, or processor intensive applications, the ATS-13A-66-C1-R0 is the perfect choice for you.
The specific data is subject to PDF, and the above content is for reference