ATS-13A-72-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13A-72-C3-R0-ND

Manufacturer Part#:

ATS-13A-72-C3-R0

Price: $ 5.15
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-72-C3-R0 datasheetATS-13A-72-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.63806
30 +: $ 4.38060
50 +: $ 4.12297
100 +: $ 3.86524
250 +: $ 3.60755
500 +: $ 3.34987
1000 +: $ 3.28546
Stock 1000Can Ship Immediately
$ 5.15
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.19°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management solutions are critical for successful operation of modern electronics equipment. Without the correct solution, the equipment will likely experience instability and malfunctions due to component overheating. One type of thermal solution gaining increasing popularity is the ATS-13A-72-C3-R0 Heat Sink, a thermal management solution ideally suited for control of conduction, convection, and radiation.

The ATS-13A-72-C3-R0 Heat Sink is a two-piece design, consisting of a base and a top cover. The base is made out of copper, and the cover is made out of aluminum. Heat generated from the electronic components is transferred to the base through conduction. The base then dissipates the heat through convection, as air passes across the exposed surfaces of the heat sink. This air is forced through the fins and past the cover, taking the heat with it. Additionally, the reflectivity of the aluminum cover reduces radiation as the heat is escaping.

This Heat Sink is often used in combination with regional blowers, fans, and other cooling systems to ensure that the equipment operates within its correct temperature ranges. As an example, the ATS-13A-72-C3-R0 Heat Sink is often used in computers, servers, or appliance control boards. The heat sink can provide increased cooling efficiency, extended product life, and help to ensure proper system performance in high temperature conditions.

The installation of the Heat Sink is easy and quick construct the base and cover, with the addition of thermal paste between the components. The thermal paste also assures good heat dissipation between the parts heat will flow from the device onto the base plate and up to the face of the cover.

The ATS-13A-72-C3-R0 Heat Sink can also be used in high power applications, including microwave ovens, motors, and more. This Heat Sink has an effective thermal performance, and can withstand temperatures up to 205 degrees Celsius and humidity ranging from 10 to 95%. The Heat Sink is also UL Recognized and RoHS Compliant. Its dimensions are 13mm x 72mm x 9mm, and it has six extended fins and four mounting holes.

In summary, the ATS-13A-72-C3-R0 Heat Sink is an ideal thermal management solution that is well suited for controlling conduction, convection, and radiation. It can be used in various electronic applications, including computers, servers, and appliance control boards, to provide efficient cooling and extended product life. This Heat Sink is quick and easy to install, and is UL Recognized and RoHS Compliant.

The specific data is subject to PDF, and the above content is for reference

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