ATS-13A-73-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Heat sinks are an important component for controlling the temperature of electronics. They help to dissipate the heat from an electronic device, allowing it to run more efficiently and at a reasonable temperature. The ATS-13A-73-C1-R0 is a value-engineered thermal device that provides good thermal performance in a variety of applications. It is a thermal-grade aluminum heat sink with a pin-fin design that has an integrated heat spreader component.The ATS-13A-73-C1-R0 consists of an extruded aluminum body and a heat spreader plate. The aluminum body is constructed of high-grade aluminum with a finish that helps dissipate heat more efficiently. The heat spreader plate is made of a aluminum or steel material and is designed to spread heat across the entire surface area of the heat sink. This helps to ensure that heat is evenly distributed across the heat sink.The heat sink\'s pin-fin design helps to increase heat transfer efficiency by allowing heat to move easily through the thinner fins. This allows the heat sink to cool quickly and efficiently. The integrated heat spreader component helps reduce the thermal resistance of the heat sink, allowing it to absorb more heat without increasing its temperature. The heat spreader plate also acts as an insulator, keeping the heat in the heat sink and preventing it from escaping into the surrounding environment.The ATS-13A-73-C1-R0 is designed to be used in a variety of applications, including computers, audio equipment and electronic circuitry. It is also suitable for use in environmental control systems, such as air conditioners and refrigerators. The thermal device is well suited to small-scale applications, due to its lightweight and compact size.The thermal performance of the ATS-13A-73-C1-R0 is excellent. The device has great heat transfer capability, allowing it to effectively transfer heat away from the source quickly and effectively. This helps to increase the overall efficiency of the electronic device and keeps it running at a consistent temperature. The heat spreader component also helps to insulate the device, preventing it from becoming too hot and damaging electronic components.In conclusion, the ATS-13A-73-C1-R0 is a well-engineered and effective thermal device that provides good heat transfer performance and insulation in a variety of applications. Its lightweight and compact size make it suitable for small-scale use, while its integrated heat spreader component helps to reduce thermal resistance and keep the components at lower temperatures. The pin-fin design also promotes efficient heat transfer, allowing the heat sink to cool quickly and effectively.

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