| Allicdata Part #: | ATS21821-ND |
| Manufacturer Part#: |
ATS-13A-74-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-74-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal-heat sink is a device designed to disperse heat away from an electronic component, to keep it within an optimal temperature range and prevent it from suffering thermal damage. The ATS-13A-74-C2-R0 is a particularly advanced and efficient thermal-heat sink, specifically designed for cooling small, densely packed components with high thermal resistance.
In the most general sense, the ATS-13A-74-C2-R0 works by drawing in ambient heat from the surrounding environment, then dissipating it away from the component it is attached to. In doing this, it helps to keep the component cool enough to prevent it from being damaged by high temperatures.
To do this, the ATS-13A-74-C2-R0 relies on a combination of advanced technologies. Firstly, it uses a combination of extruded fins and aerodynamically shaped air channels to ensure that air is constantly flowing through the heat sink, providing a constant supply of cool air. Secondly, it uses a heat pipe technology – whereby heat is transferred from the component to an internal fluid, which is then moved away from the component and dissipated into the atmosphere – to provide an efficient and effective way of transferring the heat away from the component.
The ATS-13A-74-C2-R0\'s advanced design also makes it well suited to cooling small, densely packed components with high thermal resistance. Its long, thin design ensures it is able to fit into tight spaces, while its heat pipe technology and aerodynamically shaped air channels provide an efficient and effective way of dissipating heat in tight spaces.
In terms of applications, the ATS-13A-74-C2-R0 is well suited to a wide range of tasks. Its advanced design and high thermal dissipating efficiency make it ideal for cooling CPUs, GPUs, graphics cards, and other components in desktop computers, as well as other high-end electronics such as medical equipment and navigation systems.
The ATS-13A-74-C2-R0 is an example of a highly effective and efficient thermal-heat sink, designed for cooling small, dense components with high thermal resistance. Its combination of extruded fins and aerodynamically shaped air channels ensures a constant flow of air to help keep components cool, while its heat pipe technology ensures an efficient and effective way of transferring heat away from the component and dissipating it into the atmosphere. In terms of applications, the ATS-13A-74-C2-R0 is suitable for a wide range of tasks in computers and other high-end electronics.
The specific data is subject to PDF, and the above content is for reference