| Allicdata Part #: | ATS-13A-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-13A-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are one of the most efficient ways to keep a surface or small area cool. The thermal resistance between the hot surface and the heat sink is minimised by adding fins between the heat sink and the surface to be cooled. That is why ATS-13A-75-C3-R0 is such a popular choice for applications requiring heat dissipation from small to medium heat sources.
ATS-13A-75-C3-R0 is an extruded aluminum heat sink, designed to dissipate heat from small and medium area components. It is a composed of a 6063-T6 aluminum tube extrusion with slits. The aluminum tube is attached to four 75mm fins, soldered to the base of the heat sink. The heat sink is also anodized to minimize fluctuations in the thermal performance over time.
The ATS-13A-75-C3-R0 uses a physical conduction principle to transfer the heat away from the component. The purpose of the heat sink is to provide a large surface area for the heat to transfer to. The large surface area is provided by the fins, slits, and anodized surface.
The ATS-13A-75-C3-R0 was designed to meet the cooling requirements of small and medium components operating at high temperatures. It is particularly useful for semiconductor chips, such as those found in televisions, computers, and other consumer electronics. The design of the heat sink allows the device to operate in high temperatures without the risk of overheating. The fins on the heat sink allow air to move freely over the surface of the components, providing effective cooling.
The ATS-13A-75-C3-R0 also offers a wide range of attachment options. The heat sink can be mounted with screws, rivets, or clips. The fins can be bent or extended to fit the desired area. This allows the maximum area to be covered and the most effective cooling provided. The heat sink is also flexible, allowing it to be used in many different areas.
The ATS-13A-75-C3-R0 is a valuable thermal solution for applications requiring heat dissipation from small to medium sized components. It is specifically designed to provide maximum cooling and is an excellent choice for large volume production applications. Its low cost and easy installation makes it a popular option for manufacturers. Its large surface area provides effective cooling to keep components operating safely in high temperature conditions.
The specific data is subject to PDF, and the above content is for reference