ATS-13A-80-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS21827-ND

Manufacturer Part#:

ATS-13A-80-C2-R0

Price: $ 3.72
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13A-80-C2-R0 datasheetATS-13A-80-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.38310
10 +: $ 3.29301
25 +: $ 3.20393
50 +: $ 3.02602
100 +: $ 2.84798
250 +: $ 2.67002
500 +: $ 2.58101
1000 +: $ 2.31400
Stock 1000Can Ship Immediately
$ 3.72
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 19.03°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become increasingly important in the development of modern electronic systems, as ever-increasing power densities pose major challenges to efficient heat dissipation. The ATS-13A-80-C2-R0, the latest standard in thermal solutions, has been developed to meet these challenges. The ATS-13A-80-C2-R0 is a highly effective heat sink used in a variety of applications, particularly those requiring compact and energy-efficient thermal solutions.

The ATS-13A-80-C2-R0 heat sink is designed to utilize an indirect cooling principle known as "thermal spreading". In thermal spreading, the heat is transferred from the surface of the component to the heat sink through a thermal interface material (TIM). This in turn provides a more efficient dissipation of heat than traditional contact-based options such as forced air or liquid cooling. The ATS-13A-80-C2-R0 is optimized to provide maximum surface area for increased heat conduction, helping to reduce thermal hotspots and creating a more efficient heat dissipation system.

The ATS-13A-80-C2-R0 heat sink is most commonly used in applications where space is limited. Its compact size and high surface area make it an ideal choice for use in tightly packed and densely packaged applications such as power supplies, batteries, and other small-scale electronics. It is also well suited for use in cooling applications such as microprocessors, graphics cards, FPGAs, and more.

The ATS-13A-80-C2-R0 heat sink can also be used for passive thermal management solutions. This includes cooling systems that require no external power source and can provide between 2-6° C of cooling. The thermal performance and flexibility of the ATS-13A-80-C2-R0 makes it an ideal choice for energy efficiency, extended life cycle, and ease of installation and maintenance.

The ATS-13A-80-C2-R0 heat sink is designed to work in a variety of applications, from powering embedded systems to gaming consoles and high-performance workstations. It is also well suited to medical and laboratory equipment, as it can provide reliable and consistent thermal control in these time-sensitive applications. In addition, the thermal performance can also be optimized through the use of a fan or other methods to increase cooling efficiency.

The ATS-13A-80-C2-R0 also boasts excellent durability and is corrosion-resistant, making it suitable for use in harsh environments. The construction is robust and heavy duty, making it capable of enduring even the most rigorous operating conditions. This long-lasting and reliable performance helps to ensure consistent thermal performance, while the compact size also allows for easy installation in tight spaces.

The ATS-13A-80-C2-R0 heat sink is the latest in thermal management solutions, designed to provide efficient dissipation of heat and an extended lifespan. Its compact size and robust construction, combined with its ability to provide passive thermal management, make it an ideal choice for a range of applications, from embedded systems to medical and laboratory equipment. With its high performance features, the ATS-13A-80-C2-R0 is a reliable and robust heat sink, helping to ensure consistent thermal control over a long operating life.

The specific data is subject to PDF, and the above content is for reference

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