ATS-13A-86-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.69°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

A thermal-heat sink is a device used to dissipate excess heat away from an integrated circuit or other electrical device. It may be a simple piece of metal, or a more complex assembly of various materials and parts. The main purpose of a thermal-heat sink is to increase the efficiency and safety of an electronic device by removing excess heat. The ATS-13A-86-C1-R0 is a popular thermal-heat sink used on a variety of electronics. This article will discuss its application field and working principle.

Application Field

The ATS-13A-86-C1-R0 is a thermal-heat sink designed to dissipate heat from electrical components. It is commonly used on a variety of devices, such as computers, laptops, cell phones, and other electronic devices. This sink is constructed from a variety of materials including aluminum, steel, or magnesium. Aluminum is the most common material used in the construction of thermal-heat sinks.The performance of a thermal-heat sink depends on a variety of factors. These include its size, material used for construction, and the thermal conductivity of the material. The ATS-13A-86-C1-R0 is designed with a low profile and has a low thermal conductivity, making it ideal for use on smaller electronic devices. It is able to dissipate heat efficiently from a variety of devices, including those that generate a high amount of heat.

Working Principle

The working principle of a thermal-heat sink is relatively simple. By increasing the surface area of the heat-dissipating material, it allows more heat to be dissipated from the item or device being cooled. In the case of the ATS-13A-86-C1-R0, this is achieved by using aluminum as the material for its construction. Aluminum is a good material for thermal-heat sink construction due to its excellent thermal conductivity, which means that more heat can be dissipated from the components being cooled.The ATS-13A-86-C1-R0 is designed with a special thermal system. This system consists of a series of fins that allow more surface area for the heat to transfer to. It also has a thermal interface material, which is a special material that ensures a better transfer of heat between the heat-dissipating material and the electronic component being cooled. As the heat is dissipated away from the electronic component, the thermal-heat sink can remain cooler.

Conclusion

The ATS-13A-86-C1-R0 is a popular thermal-heat sink used to dissipate heat from a variety of electrical and electronic devices. It is constructed from aluminum, which has a low thermal conductivity, making it ideal for the efficient removal of heat. The ATS-13A-86-C1-R0 is designed with a special thermal system that includes fins for increased surface area and a thermal interface material for improved heat transfer. This makes it an ideal thermal-heat sink for small electronic devices that generate a lot of heat.

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