| Allicdata Part #: | ATS-13A-95-C1-R0-ND |
| Manufacturer Part#: |
ATS-13A-95-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13A-95-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used in the application of ATS-13A-95-C1-R0, due to the importance of controlling heat and delivering maximum performance. As this particular product is designed to cool electronics, it is important to understand the working principle behind the system and how it helps to achieve thermal management.
The ATS-13A-95-C1-R0 consists of two main components; a copper base and an aluminum fin array. The ability to cool electronics is provided through the combination of these two elements as increased conduction and convection occur simultaneously.
Starting with the copper base, this element provides high conductivity to dissipate heat away from the components quickly to the surrounding environment. Additionally, it has the capability to spread this energy in multiple directions which creates the cooling effect we need. Secondly, the aluminum fin array, which is attached to the base, increases the surface area and allows for maximum airflow. This is significant as it encourages heat away from the system quicker and more efficiently.
These two elements work together to provide a reliable cooling solution for electronic components. The process begins with the copper base receiving the heat energy, and as the system heats up, this energy is transferred via conduction to the walls of the enclosure. This heat is then spread by the fins of the aluminum fin array and the air passes over them which carries it away from the system, resulting in improved thermal management.
The ATS-13A-95-C1-R0 Thermal Heat Sink is a great solution for cooling electronics as it has the capability to transfer large amounts of heat energy and dissipate it away quickly. In addition, it can be used in a variety of applications due to its easy installation and simple design. Overall, it is an excellent product for those looking to control their thermal environment and maximize their system’s performance.
The specific data is subject to PDF, and the above content is for reference