ATS-13A-98-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.29°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal - Heat Sinks are a type of passive cooling device used in many electronic products. They are most commonly used to transfer heat away from components and circuits, allowing them to run cooler and more efficiently. Heat Sinks are commonly found in laptop computers, desktop PCs, and other electronic devices.Heat Sinks are made of a variety of materials, including aluminum, copper, and plastic. The most common type of Heat Sink is a thermal spreader, which has a large area of fins or fins that spread out heat away from the device or circuit. It is important to ensure that the Heat Sink is large enough and of the right material to efficiently dissipate heat away from the components or circuit. The ATS-13A-98-C1-R0 is a Heat Sink designed specifically for applications that require reliable thermal management. This Heat Sink is made of aluminum, which is an efficient material for dissipating heat. It is designed to be used in electronics such as power supply electronics, computer systems, and other applications where reliable cooling is required.

ATS-13A-98-C1-R0 Application Field and Working Principle

The ATS-13A-98-C1-R0 is a thermal spreader designed to provide efficient cooling for electronic components and circuits. It consists of a large area of fins that spread out heat from the device, allowing it to run cooler and more efficiently. The design of the fins ensures optimal air flow, which increases the efficiency of heat dissipation. The ATS-13A-98-C1-R0 is designed for power supply electronics and other applications where reliable cooling is required. It is capable of dissipating 24 watts of heat with a thermal resistance of 0.1°C/W. This Heat Sink is designed to be used with up to 12-volt power supplies and can operate in temperatures up to 105°C.The ATS-13A-98-C1-R0 is designed with a low-profile design for easy installation in tight spaces. It is designed with a self-adhering base for secure installation, as well as an integrated heat spreader to provide maximum effectiveness for dissipating heat. The aluminum fins are designed to provide effective cooling even in high temperature environments.The ATS-13A-98-C1-R0 has been designed to be robust and reliable in any environment. It is designed with a high-temperature resistance of 105°C and an ultra-low thermal resistance of 0.1°C/W. This Heat Sink is also designed to reduce the size and weight of the device, allowing it to be used in more compact designs.

Conclusion

The ATS-13A-98-C1-R0 is a thermal spreader designed for applications that require reliable thermal management. It is designed with a low-profile design to fit into tight spaces, and the self-adhering base ensures secure installation. The aluminum fins are designed for efficient heat dissipation and the integrated heat spreader provides maximum effectiveness for heat dissipation. The ATS-13A-98-C1-R0 is designed to provide reliable cooling for up to 12-volt power supplies and it can operate in temperatures up to 105°C. It has an ultra-low thermal resistance of 0.1°C/W and is designed to provide maximum effectiveness for dissipating heat. This Heat Sink is the perfect choice for applications that require reliable cooling and efficient thermal management.

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