ATS-13B-06-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.27°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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The ATS-13B-06-C3-R0 is part of a larger family of heat sinks and thermal management products used in a variety of applications. Heat sinks are used to dissipate thermal energy from electronic circuits and components to prevent them from overheating and malfunctioning. Heat sinks, also known as thermal conductors, contain metal fins and surfaces that allow air to flow through them, allowing for efficient transfer of heat. The various types of heat sinks are used in different applications depending on their specific characteristics and thermal properties.The ATS-13B-06-C3-R0 is a designed as a fanless heat sink. It is an ideal choice for applications that require low airflow, such as handheld electronics. It is made from aluminum alloy and is designed to efficiently dissipate heat. It features a unique array of fins that provide efficient heat dissipation, while also providing noise dampening features. This thermo product is also designed to withstand high heat levels without deforming or becoming damaged.The ATS-13B-06-C3-R0 is designed to work in a variety of applications. It is suitable for cooling LED modules, power transistors, laser diodes, plasma televisions, HDMI ports, and many other applications that require cooling. It is also suitable for use in higher heat applications, such as Flash memory. In these cases, the heat sink is designed to operate with an additional fan to cool the heat-generating components.The design of the ATS-13B-06-C3-R0 allows for efficient heat transfer and dissipation. The fins provide a large surface area for air to flow through. The air moves over the fins, transferring the heat away from the component and out of the heat sink. This helps keep the components within a safe temperature range and prevents them from overheating. Additionally, the design of the heat sink helps to reduce noise levels in the environment.The ATS-13B-06-C3-R0 is a great choice for a variety of thermal management applications. It is designed to efficiently dissipate heat from components, while keeping noise levels low. Its compact design makes it ideal for use in a variety of space-constrained applications, while providing reliable and efficient cooling. Additionally, its aluminum construction ensures that it can withstand high temperatures, making it a great choice for high heat applications.

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