ATS-13B-09-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.58°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-13B-09-C2-R0 is a thermal-heat sink that is designed to provide thermal management and cooling for electronic components. It is an efficient device with a wide range of applications. This article will discuss the application fields and working principle of the ATS-13B-09-C2-R0, and evaluate its potential to provide effective thermal-heat sink solutions.

Application Fields

The ATS-13B-09-C2-R0 can be used in a wide range of applications. It is ideal for use in areas such as industrial electronics, automotive electronics, communications systems, display systems, and more. It is a reliable and effective thermally-managed heat sink solution that can be used in a variety of conditions. The ATS-13B-09-C2-R0 can also be used to manage the temperature of a range of electronic components. For example, it can be used to cool the power amplifier module, RF transmission unit, or embedded board used in telecommunication equipment. It can also be used to cool PCBs, storage elements, or embedded boards used in embedded systems. Furthermore, it can be used in a variety of different cooling applications, including water-cooling systems, air-cooling, and heat-exchanger systems.

Working Principle

The ATS-13B-09-C2-R0 is designed to transfer heat away from the electronic components into its heat-sink surface. It does this by increasing the surface area of the heat sink, which increases its efficiency in dissipating heat. The heat sink is designed to be placed in direct contact with the device, to enable maximum transfer of heat and allow the most efficient cooling of the components. The ATS-13B-09-C2-R0 is equipped with a fan to increase the airflow over the heat sink surface and improve cooling efficiency. The fan is designed to run at low speed, low noise, and low electrical power consumption levels. Furthermore, the fan is designed to be highly efficient and could run continuously without increasing the temperature of the environment.

Conclusion

The ATS-13B-09-C2-R0 thermal-heat sink is an effective and reliable device for providing thermal management and cooling of electronic components. Its wide range of application fields makes it suitable for a variety of applications, from industrial electronics to automotive electronics. Furthermore, its efficient working principle ensures effective transfer of heat away from the components, providing effective thermal solutions.

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