ATS-13B-10-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.89°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat SinksHeat sinks are a type of thermal management device used to cool electrical and electronic equipment using natural convection and thermodynamics. Heat sinks are commonly used to improve the efficiency of electrical and electronic components and reduce their thermal stress. The ATS-13B-10-C2-R0 is a type of heat sink designed for a wide range of applications, including LED lighting, consumer electronics, and industrial equipment. The ATS-13B-10-C2-R0 is designed to be a small, lightweight heat sink with a relatively low profile. The device is 3" tall, 4" wide, and 2" deep, and has a total weight of 2.2 ounces. The device features a base plate made of aluminum with a built-in copper tube heat pipe for efficient heat transfer. The ATS-13B-10-C2-R0 is designed to dissipate heat efficiently from high power systems, providing improved thermal management in a range of applications.The ATS-13B-10-C2-R0 utilizes an off-the-shelf heat sink solution that provides excellent thermal performance, with a minimum total thermal resistance of 0.25°C/W and a maximum total thermal resistance of 1.2°C/W. The base plate is constructed from aluminum and the heat pipe is constructed from copper, providing the necessary thermal conductivity for efficient heat dissipation. The device is also equipped with a thermal pad for additional heat dissipation and thermal bonding with components.The ATS-13B-10-C2-R0 is designed to operate in a range of ambient temperatures from -40°C to +150°C. The heat sink is designed to operate efficiently with a wide range of devices, including LEDs, CPUs, GPUs, and FPGAs. The device is capable of dissipating as much as 20 Watts of heat, making it an ideal choice for medium- to high-power applications.One of the advantages of the ATS-13B-10-C2-R0 is its flexibility and versatility. The device is rated for a range of force (0.3 kgf to 5.0 kgf) and can adapt quickly to different mounting requirements. The device is also designed to fit a range of component sizes, from 2mm x 2mm to 10mm x 10mm.In addition to its thermal performance, the ATS-13B-10-C2-R0 is also designed for easy installation and maintenance. The device features an easy-to-install fingerscrew design, making it effortless to install or remove as needed. The device is also equipped with a thermal pad for maximum heat dissipation and more efficient thermal bonding with components.In conclusion, the ATS-13B-10-C2-R0 is an ideal choice for applications that require a reliable, efficient and easy-to-install heat sink. The device has a wide range of applications, and is designed to deliver reliable thermal performance with minimal effort. The device also features a range of mounting options and is equipped with a thermal pad for efficient heat dissipation. The ATS-13B-10-C2-R0 offers an excellent choice for applications that require low profile, lightweight, and efficient thermal management.

The specific data is subject to PDF, and the above content is for reference