| Allicdata Part #: | ATS-13B-100-C3-R0-ND |
| Manufacturer Part#: |
ATS-13B-100-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-100-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly crucial in modern applications, from computers and communication devices to industrial equipment and hybrid electric vehicles (HEV). heat sink architecture, made from either aluminum or copper, is a key component for effective thermal management. As an example of this, the ATS-13B-100-C3-R0 thermal heat sink is a highly efficient heat dissipation device designed for a wide variety of industrial, electronic, and automotive applications.
The ATS-13B-100-C3-R0 has a finned architecture, which means that it expands the air-cooled surface area available for heat transfer, thus providing superior heat transfer performance. The sink comes with two embedded channels for fluid or forced convection, which increases the thermal load capacity and decreases thermal resistance. This increases the ability of the sink to rapidly shed heat from its surfaces. The sink also features a fin profile designed to work in harsh environments, making it highly resistant to corrosion and other environmental factors.
The ATS-13B-100-C3-R0 has a physical dimension of 100mm x 100mm and a thickness of 13mm. It is made of aluminum or copper, depending on the application. The cover plate is 25/36mm thick and is made of either stainless steel or titanium. The sink comes with pre-drilled holes, allowing for easy installation on a variety of brackets and mounting systems.
The major application field for this thermal heat sink is to dissipate high thermal loads generated by a variety of industrial components, such as computers, power supplies, power controllers, and other high-powered electronics. It is also used in medical and automotive applications, where it can help maintain a safe operating temperature for sensitive components.
The working principle of the ATS-13B-100-C3-R0 is quite simple. The heat generated by the components is transferred to the heat sink surface, where it is then dissipated into the surrounding environment by natural or forced air convection. The heat sink is designed to facilitate this process, by taking advantage of the finned architecture and pre-drilled mounting holes. The fins are used to increase the effective surface area available for air convection and the mounting holes allow for easy installation of the sink to brackets or other mounting systems.
In summary, the ATS-13B-100-C3-R0 thermal heat sink is a highly efficient heat dissipation device designed for a wide variety of industrial, electronic, and automotive applications. The physical dimensions and finned architecture of the sink make it ideal for high-powered components, where it is able to rapidly dissipate heat into the surrounding environment. Its pre-drilled mounting holes provide easy installation to a variety of brackets or other mounting systems. Therefore, the ATS-13B-100-C3-R0 makes an excellent choice for thermal management applications, where superior heat transfer performance is required.
The specific data is subject to PDF, and the above content is for reference