| Allicdata Part #: | ATS-13B-107-C3-R1-ND |
| Manufacturer Part#: |
ATS-13B-107-C3-R1 |
| Price: | $ 4.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-107-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.44150 |
| 30 +: | $ 4.19496 |
| 50 +: | $ 3.94808 |
| 100 +: | $ 3.70138 |
| 250 +: | $ 3.45462 |
| 500 +: | $ 3.20786 |
| 1000 +: | $ 3.14617 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13B-107-C3-R1 is a type of Thermal - Heat Sink technology which is widely used in a variety of applications. This technology is based on the principle that the cooling of high-powered electronic components, systems and chips is achieved by dissipating the generated heat using a series of metals and other materials. This technology is especially useful for distributed power systems where multiple loads need to be maintained at optimum temperatures, to ensure system reliability.
The ATS-13B-107-C3-R1 is made up of three main components which are the base, the heat dissipater, and the pin fin array. The base is an aluminum plate which is connected to the motherboard and on which the heat dissipater is mounted. The heat dissipater is the component which is meant to draw the heat away from the component. It consists of a series of metals, which are held together with ceramic material, and is optimized for maximum thermal conductivity, so as to ensure maximum heat dissipation.
The pin fin array is a thermally efficient structure which helps to increase the surface area of the heat dissipater, thus aiding in the heat dissipation process. This is achieved by using a series of thin metal fins which draw the heat off the surface of the heat dissipater and dissipate it into the surrounding air. This is an effective way to dissipate heat from high-powered electronics, thus ensuring better reliability, performance and longevity for the system.
The advantage of using the ATS-13B-107-C3-R1 for cooling high-powered electronics is that it is very efficient in dissipating heat. It also reduces the noise levels and provides a much cooler and quieter environment for the components to operate in. This makes it suitable for applications such as network servers, personal computers, and industrial machinery.
This technology is also very versatile, as it can be used in different applications, depending on the specific needs. It can be used for cooling high-power components, such as processors and graphics cards, as well as for passively cooling the entire system. This makes it ideal for applications such as cooling servers, desktop computers, personal computers, laptops, and even gaming systems.
Apart from being used for cooling components, the ATS-13B-107-C3-R1 can also be used for heat transfer purposes. This technology is often used in automotive and industrial applications, as it can help to reduce the temperature of fluids and metal surfaces, thus reducing the possibility of failure. This makes it highly efficient and a cost effective solution for cooling and heat transfer applications.
The ATS-13B-107-C3-R1 is a highly efficient and cost effective way to cool and dissipate heat from high-powered electronic components and systems. It is an ideal solution for a wide variety of applications, such as personal computers, network servers, industrial machinery, gaming systems and automotive and industrial applications. It is a reliable and efficient way to provide thermal management for any system.
The specific data is subject to PDF, and the above content is for reference