ATS-13B-110-C2-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.99°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal – Heat Sinks: ATS-13B-110-C2-R1 Application Field and Working Principle

Thermal – Heat Sinks are small nick assemblies that use several small pieces of metal to disperse heat. These dissipaters helps to keep electronic components and other delicate parts cool and running optimally. More specifically, they can be used to transfer heat from a processor to the surrounding airflow, removing it from the components and allowing them to operate at its peak performance. Among them, ATS-13B-110-C2-R1 is one of the most commonly used thermal – heat sinks due to its low cost and high performance.

The Features of ATS-13B-110-C2-R1

ATS-13B-110-C2-R1 is a highly efficient thermal heat sink with a nominal power of 300W and a thermal resistance of 0.44K/W. It is constructed from a high quality die-cast aluminum heat sink, and features several fins on its surface that help disperse heat from the processor core. Additionally, it includes a thermally conductive adhesive backing in order to adhere to the processor, enhancing the overall performance and heat transfer from the core.

Application Field and Working Principle of ATS-13B-110-C2-R1

The ATS-13B-110-C2-R1 is mainly used in applications involving high power processors, such as CPU and GPU. Additionally, it is very common in applications that require a low temperature environment such as computer servers. Furthermore, this thermal heat sink is often used in closed loop systems, such as water cooling systems, in order to regulate the temperature of a given system. The working principle behind the ATS-13B-110-C2-R1 is quite simple; basically, it uses the heat sink’s highly efficient fins to transfer the heat away from the processor and into the surrounding environment. Heat transfer is facilitated by the thermal glue that attaches the processor to the heat sink and the thermal conduction properties of the aluminum heat sink body. Additionally, the fan installed on the ATS-13B-110-C2-R1 helps to further reduce the processor core temperature and improve system performance.

Conclusion

The ATS-13B-110-C2-R1 is a very efficient and cost-effective thermal heat sink, offering excellent performance and low temperatures. This thermal heat sink is suitable for a wide range of applications, including high power processing and closed loop systems, and helps to reduce overall system temperatures significantly. Additionally, its simple working principle makes it simple to install and easy to use. Overall, the ATS-13B-110-C2-R1 is an excellent choice of thermal heat sink for any application.

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