ATS-13B-111-C1-R1 Allicdata Electronics
Allicdata Part #:

ATS-13B-111-C1-R1-ND

Manufacturer Part#:

ATS-13B-111-C1-R1

Price: $ 5.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X40X9.5MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13B-111-C1-R1 datasheetATS-13B-111-C1-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.90455
30 +: $ 4.63176
50 +: $ 4.35935
100 +: $ 4.08694
250 +: $ 3.81448
500 +: $ 3.54201
1000 +: $ 3.47390
Stock 1000Can Ship Immediately
$ 5.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.362" (60.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.72°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Introduction

Heat sinks, in general, are thermal components that help manage heat and transfer it away from sensitive components and other things of that nature. The ATS-13B-111-C1-R1 is a heat sink with a variety of uses. It is used on a number of apparatuses, from computers to TVs to medical equipment. This article will explore the application field and working principles of the ATS-13B-111-C1-R1 thermal heat sink.

Application fields

The ATS-13B-111-C1-R1 is used in a variety of different applications and settings. One of the most common applications is within computer components, such as CPUs, GPUs, and other processors. This heat sink helps to manage the heat output from these components to ensure that the component does not overheat and malfunction. The sink is attached to the component through a mounting bracket, which also serves the purpose of providing some insulation between the component and the heat sink. This helps to ensure that the sink does not transfer too much heat away from the component as well.

The ATS-13B-111-C1-R1 heat sink can also be used with TVs. Modern TVs produce a lot of heat, and as such, it is important to keep this heat away from the internal components. This sink is ideal for this purpose, as it is designed to dissipate the heat away from the TV’s internal components. This helps to ensure that the TV does not overheat and malfunction.

The ATS-13B-111-C1-R1 heat sink has also been used in medical equipment such as X-ray machines. X-ray machines generate a lot of heat, which needs to be managed properly to ensure that the machine does not overheat and malfunction. The ATS-13B-111-C1-R1 is an ideal choice for this purpose, as it is designed to dissipate the heat away from the components and help to keep the machine running efficiently.

Working principle

The ATS-13B-111-C1-R1 thermal heat sink works on the principle of conduction. It is made up of two different materials – a heat sink material and a heat dissipating material. The heat sink material is usually aluminium, copper, or some other heat conducting metal. The heat dissipating material is usually either a ceramic, plastic, or other material that is designed to help dissipate the heat away from the sink.

The heat sink works by allowing the energy from the component to be transferred to the heat sink material. This material then transfers the heat to the heat dissipating material, which helps to dissipate the heat away from the component. The sink also incorporates fins to help spread the heat away from the component even more. This helps to ensure that the heat is dispersed away from the components quickly and efficiently.

In summary, the ATS-13B-111-C1-R1 thermal heat sink is a versatile and useful component that can be used in a number of applications. It is designed to help manage and dissipate the heat away from sensitive components, helping to ensure that these components do not overheat and malfunction. The sink works on the principle of conduction, using heat sink material and heat dissipating material to help transport and disperse the heat away from the component. This helps to ensure that the components operate efficiently and reliably.

The specific data is subject to PDF, and the above content is for reference

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