ATS-13B-117-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13B-117-C1-R0-ND

Manufacturer Part#:

ATS-13B-117-C1-R0

Price: $ 3.09
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13B-117-C1-R0 datasheetATS-13B-117-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.78208
30 +: $ 2.70669
50 +: $ 2.55629
100 +: $ 2.40591
250 +: $ 2.25553
500 +: $ 2.18034
1000 +: $ 1.95479
Stock 1000Can Ship Immediately
$ 3.09
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are used to “dissipate” or spread heat away from hot components, such as transistors and other semiconductor devices, and to keep the parts cool. Thermal management is important for the longevity and reliability of computer systems and other electronic devices. The ATS-13B-117-C1-R0 heat sink is specifically designed for these types of applications, offering an efficient and cost-effective way to keep components at the optimal temperatures. The ATS-13B-117-C1-R0 heat sink is made of aluminum to ensure excellent thermal conductivity. It features heat spreader fins which are designed to rapidly draw heat away from the component, while also increasing surface area for more effective cooling. The heat sink features an optimized design which provides an efficient and effective way to keep components cool. The ATS-13B-117-C1-R0 heat sink is designed to be easily installed in tight spaces. It has a low profile design which allows the heat sink to be easily mounted in tight spaces. The heat sink is also designed to have a low noise profile. The heat spreader fins are designed to generate minimal sound, making it ideal for applications where noise levels are a concern. The ATS-13B-117-C1-R0 heat sink is perfect for applications such as systems for industrial automation, telecommunication, medical, automotive, consumer electronics, and other applications where thermal management is of utmost importance. The working principle of the ATS-13B-117-C1-R0 heat sink is simple. The aluminum material is designed to quickly draw heat away from the component, while the heat spreader fins increase surface area and reduce hot spots. The heat spreader fins allow for more effective cooling of components, while also reducing noise levels. The ATS-13B-117-C1-R0 heat sink is an efficient and cost-effective way to keep components at the optimal temperatures, making it ideal for a wide range of applications. The heat sink is easy to install in tight spaces and can be used in a variety of applications where thermal management is of utmost importance. The aluminum material and optimized design ensure a high level of thermal performance, while the heat spreader fins keep noise levels at a minimum. The ATS-13B-117-C1-R0 heat sink is an excellent choice for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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