| Allicdata Part #: | ATS21878-ND |
| Manufacturer Part#: |
ATS-13B-12-C2-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-12-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.78000 |
| 10 +: | $ 3.67794 |
| 25 +: | $ 3.47382 |
| 50 +: | $ 3.26957 |
| 100 +: | $ 3.06520 |
| 250 +: | $ 2.86086 |
| 500 +: | $ 2.65651 |
| 1000 +: | $ 2.60542 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become essential to modern electronics and devices, and thermal heat sinks are often a critical component of thermal solutions. The ATS-13B-12-C2-R0 is a high-performance thermal heat sink that is designed to efficiently dissipate heat away from sensitive electronic components. The ATS-13B-12-C2-R0 is intended for applications where heat dissipation is a priority, such as in power electronics, automotive, industrial, and medical applications.
The ATS-13B-12-C2-R0 features a highly efficient design that is optimized to provide maximum heat dissipation while minimizing space and weight. The base of the heat sink is made of high-grade aluminum alloy extrusion and is available in either an anodized or nickel-plated finish to provide excellent corrosion protection. The fin area is also made of aluminum alloy and is designed to achieve maximum air-flow for effective heat dissipation. Additionally, the ATS-13B-12-C2-R0 is designed with a universal mount pattern to make installation easy and efficient.
The primary design of the ATS-13B-12-C2-R0 is based on the natural principle of convection cooling. This is the process by which heat is transferred from one surface to another through the circulation of a fluid, such as air or liquid. In the case of the ATS-13B-12-C2-R0, the heat transfer takes place from hot components on a circuit board and from the base of the heat sink. The heat is then dissipated away from the components by the flow of air through the fins of the heat sink.
The design of the ATS-13B-12-C2-R0 is also optimized for fan-assisted cooling. This process involves placing a fan near to the heat sink to further increase the efficiency of heat removal. The fan helps to drive air over the fins, and therefore increase the rate of air flow and heat dissipation. The ATS-13B-12-C2-R0 also has external fins that are positioned to maximize the cooling of components.
The ATS-13B-12-C2-R0 is well-suited to power electronics applications such as motor drivers, DC/DC converters, and circuit protection, as well as automotive and medical designs. Its aluminum material construction makes it sturdy and highly resistant to corrosion, while its high-performance design and universal mount pattern ensure effective heat dissipation and easy installation. The ATS-13B-12-C2-R0 is a reliable and efficient thermal heat sink for a variety of applications.
The specific data is subject to PDF, and the above content is for reference