| Allicdata Part #: | ATS-13B-12-C3-R0-ND |
| Manufacturer Part#: |
ATS-13B-12-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-12-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are widely used in electronics as a way to dissipate heat generated by components in a power system. The ATS-13B-12-C3-R0 is a type of thermal heat sink specially designed for applications in telecommunications, medical, and military sectors where extreme reliability is required. It is also suitable for heavy industrial applications with high speed operation.
The ATS-13B-12-C3-R0 has a high volume-to-surface area ratio, which helps with the efficient transfer of heat away from the components. In addition, it also has large shorting rings that create uniform pressure distribution throughout the component package, ensuring that the heat transfer is even and reliable. Its low profile and profile modules reduce the overall area requirements, making it ideal for applications where space is at a premium.
The ATS-13B-12-C3-R0 is constructed from high quality aluminum alloy, which provides excellent thermal conductivity and excellent electrical insulation. The heat dissipating fins have also been designed to combine with this alloy to ensure efficient heat distribution. The fins can be customized to fit specific components, providing greater flexibility in the application environment. The fins are designed to be embedded within the fins, to ensure maximum efficiency.
The ATS-13B-12-C3-R0 uses a closed loop design, meaning that the heat is transferred into a central chamber and then released. This closed loop design is more reliable than traditional heat sink designs, as it avoids the heat being lost through conduction or convection. Additionally, the enclosed chamber ensures that the components remain at a constant temperature, making them less prone to damage from high temperatures. Moreover, the closed loop design also offers greater flexibility as it can be adjusted to different ambient temperatures.
The thermal management capabilities of the ATS-13B-12-C3-R0 are further enhanced by its ability to dissipate heat with a higher level of efficiency than traditional heatsinks. It also has a high capacity for cooling in a wide range of temperatures. This allows it to be used in high temperature applications, such as medical and military applications, where the temperature can reach extreme levels. Additionally, its low profile makes it suitable for both ceiling or mounting directly onto components.
The ATS-13B-12-C3-R0 provides an ideal solution for applications that need high levels of reliability and thermal management. Its high capacity for cooling and uniform pressure distribution make it suitable for a wide range of applications. Furthermore, its low profile and profile modules make it suitable for applications where space is at a premium.
The specific data is subject to PDF, and the above content is for reference