ATS-13B-126-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.54°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-13B-126-C3-R0 is a heat sink, designed to provide advanced thermal management solutions for a wide range of applications. It has been designed with features such as high-performance thermal conductivity, low-weight dielectric alloys, and reliable thermal management making it an excellent choice for any application requiring thermal management.The ATS-13B-126-C3-R0 is designed to transfer heat from an electronic component such as a processor or power supply, to the environment or another component. It operates by allowing the heat created from an electronic component to be dissipated into its surrounding environment. Heat sinks work on the same principle that helps disperse hot air in a room by using fans. It takes the heat away from the source and disperses it evenly throughout the environment where it can be safely dissipated. The thermal conductivity of the ATS-13B-126-C3-R0 ensures rapid heat transfer and with its lightweight design, it is capable of supporting a wide range of applications.The ATS-13B-126-C3-R0\'s superior performance is supported by its dielectric alloys. These alloys provide reliable thermal management by transferring heat in the most efficient manner possible. The alloys are lightweight and durable and can withstand extreme temperature range. The dielectric alloys can resist temperature fluctuations, allowing it to provide consistent heat dissipation.One of the main advantages of using ATS-13B-126-C3-R0 is its low-weight and reliable thermal management. This heat sink offers superior thermal performance, allowing it to handle the heat generated by multiple components. It also offers excellent reliability due to its heavy-duty construction. It is also available in a range of sizes making it suitable for different applications.ATS-13B-126-C3-R0 is ideal for applications in various industries. It is especially well-suited for applications in the telecommunications, automotive, and computing sectors. In the automotive sector, this heat sink is ideal for controlling the heat generated by heavy-duty engines. In telecommunications, it is capable of providing optimal thermal management for efficient part binning. It is also suitable for applications in the computing industry such as for the cooling of processors and motherboards.ATS-13B-126-C3-R0 offers excellent reliability and superior thermal performance, allowing it to be used in a wide range of applications. With its lightweight design and dielectric alloys, it is able to provide reliable heat dissipation. This heat sink is available in various sizes and is designed for a wide range of applications in different industries. It is ideal for applications requiring efficient and reliable thermal management.

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