| Allicdata Part #: | ATS21886-ND |
| Manufacturer Part#: |
ATS-13B-127-C2-R0 |
| Price: | $ 4.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-127-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.12650 |
| 10 +: | $ 4.01373 |
| 25 +: | $ 3.79058 |
| 50 +: | $ 3.56769 |
| 100 +: | $ 3.34473 |
| 250 +: | $ 3.12175 |
| 500 +: | $ 2.89877 |
| 1000 +: | $ 2.84303 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical component of any electronic system, and the design and implementation of appropriate heat sinks are essential for reliable, high-performance operation. The ATS-13B-127-C2-R0 is a versatile, low-cost thermal heat sink, suitable for a variety of applications. Its superior performance characteristics and robust construction make it an ideal choice for efficient heat dissipation in a wide variety of electronic designs.
The ATS-13B-127-C2-R0 is constructed of extruded aluminum heat sink material, providing excellent thermal performance and ease of installation. Its low-profile design permits use in tight spaces and ensures compatibility with a variety of components. The components feature discrete heat pipes and gas columns to increase heat transfer efficiency, while maintaining optimum airflow. The use of copper-clad joints and a special anodized aluminum material further enhances conduction and convection of heat.
The thermal behavior of the ATS-13B-127-C2-R0 can be adjusted according to the specific application through control of the air gap between the top and bottom sections of the heat sink. The air gap has a direct effect on the heat transfer rate, and can help ensure optimal thermal performance for any given application. By managing the air gap carefully, the ATS-13B-127-C2-R0 can effectively dissipate heat, maintaining temperatures at a comfortable level.
When used in typical applications, the ATS-13B-127-C2-R0 requires no external cooling fans or other hardware. Its large surface area and efficient heat transfer design promote efficient operation under most conditions. The device can also be used in conjunction with auxiliary cooling fans to further improve thermal performance for demanding applications.
The ATS-13B-127-C2-R0 is a reliable solution for thermal management of high-power electronic components. It is designed to provide uniform cooling of sensitive circuitry and components, eliminating hotspots and improving product life and reliability. The device is also suited for use in extreme environments, providing reliable thermal management even under the most demanding operating conditions.
By using the ATS-13B-127-C2-R0, engineers can be sure of reliable and efficient thermal management. With its robust construction and versatile design, the device offers superior thermal performance while being easy to install and maintain. From automotive electronics to power supplies and medical equipment, the ATS-13B-127-C2-R0 is the ideal thermal management solution for any application.
The specific data is subject to PDF, and the above content is for reference