| Allicdata Part #: | ATS21894-ND |
| Manufacturer Part#: |
ATS-13B-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is the need of the hour for modern electronic devices. ATS-13B-134-C2-R0 is a statement of heat sinks, an important component in the thermal management package. A proper understanding of the application field and working principle of ATS-13B-134-C2-R0 is essential to guarantee proper cooling requirements of any electronic devices.
Heat Sinks are passive heat exchangers, which draw heat away from the surface of an object and disperse it into the environment. They are mainly used in electronic circuits to dissipate heat as preventing overheating from damaging the device is very important. Heat sinks are available in different types, sizes and shape depending on their application and the amount of heat it must dissipate.
ATS-13B-134-C2-R0 is one such short-pin and low profile heat sink with standard footprint of134 ((13*13)mm2). High thermal conductivity aluminium alloy with high tensile strength is used to manufacture ATS-13B-134-C2-R0. This heat sink is suitable for attaching to surface mounted devices (SMD) on printed circuit boards (PCB). As this heat sink features a low profile height of 14mm and lightweight design of 5.1g, it is highly preferred to reduce device profile and weight.
Working on the principle of convection, the ATS-13B-134-C2-R0 efficiently dissipates heat by circulating it from a hot to cold medium with air being the most commonly utilized medium. This heat sink comprises many fins which present a high surface area to the environment. This increase in surface area allows heat dissipation more efficient via conduction. As the ATS-13B-134-C2-R0 has superior natural convection characteristics, air is moved across the fins of the heat sink is increased and further increases heat dispersion.As ATS-13B-134-C2-R0 has a long operating life with excellent resistance to thermal shock, vibration and chemical corrosion, it is widely used in the application areas like power supplies, relay/sensing, motor control, STBs, surveillance systems, laptops, Industrial and consumer device, LED lamp and medical devices etc.
Extremely reliable in functioning, the ATS-13B-134-C2-R0 is an ideal thermal management solution for any electronic device. Its long-term heat dissipation performance along with its operation life makes it the best choice for the thermal management of your electronic devices. Therefore, investing in the ATS-13B-134-C2-R0 can provide many benefits to any device and ensure that it gets the most efficient cooling.
The specific data is subject to PDF, and the above content is for reference