| Allicdata Part #: | ATS21904-ND |
| Manufacturer Part#: |
ATS-13B-143-C2-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-143-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.55320 |
| 10 +: | $ 3.45933 |
| 25 +: | $ 3.36596 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to the performance of modern electronics. Heat sinks are used to maximize the thermal performance of electronic components and devices in a wide variety of applications. The ATS-13B-143-C2-R0 is a highly efficient heat sink for cooling and dissipating electrical and electronic components.
Design Overview
The ATS-13B-143-C2-R0 is a heat sink from the Thermal-Heat Sink family. It has an aluminum alloy construction for maximum reliability and lightweight design. The dimensions of this model are 13.99 W x 8.79 H x 0.88 D inches and a nominal weight of 2.95 lbs. This heat sink is equipped with a round aluminum manifold for soldering components to its sides for heat dissipation. It also has a modified low speed fan that allows the device to function efficiently in all operating conditions.
Application Field
The ATS-13B-143-C2-R0 is designed to dissipate heat from a wide variety of electrical and electronic components such as CPUs, GPUs, power amplifiers, power supplies, UPS systems, and other temperature-sensitive components. It is suitable for a variety of applications in high-temperature, high-load environments such as computers, automotive, medical, and industrial equipment.
Working Principles
The ATS-13B-143-C2-R0 is a heat sink made of an aluminum alloy body. The aluminum alloy has the advantage of being lightweight, highly corrosion-resistant, durable, and thermally efficient. This heat sink relies on air cooling for its efficient operation. The low speed fan design helps to move heat away from the heat-generating component and evenly distribute heat over the entire surface of the heat sink for optimal cooling performance. Additionally, the curved louvers of the fan come constructed with a special depression angle that helps to increase the amount of air that is pushed through the fins for improved cooling.
Advantages
The ATS-13B-143-C2-R0 is an excellent heat sink option as it offers several advantages. It has a low-profile design that allows for easy installation. Its lightweight aluminum material makes it highly durable and reliable. Additionally, since it is suitable for a wide range of applications, it is a flexible and adaptable solution to thermal management. This makes it an ideal choice for heat sinks in various types of industrial, medical, and automotive applications.
Conclusion
The ATS-13B-143-C2-R0 is an efficient and reliable heat sink for cooling and dissipating electrical and electronic components. It is made of a lightweight aluminum material that offers durability and exceptional thermal performance. The design of this heat sink utilizes low speed fans for improved air flow and greater heat dissipation. Its low-profile design makes it easy to install and suitable for a variety of applications. The ATS-13B-143-C2-R0 is an excellent choice for electronic components in need of thermal management, making it a valuable addition to the Thermal-Heat Sink family.
The specific data is subject to PDF, and the above content is for reference