
Allicdata Part #: | ATS21922-ND |
Manufacturer Part#: |
ATS-13B-16-C2-R0 |
Price: | $ 4.45 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X10MM XCUT T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 4.05090 |
10 +: | $ 3.94443 |
25 +: | $ 3.72506 |
50 +: | $ 3.50608 |
100 +: | $ 3.28690 |
250 +: | $ 3.06777 |
500 +: | $ 2.84864 |
1000 +: | $ 2.79387 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 2.126" (54.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Application Field and Working Principle of ATS-13B-16-C2-R0 Thermal - Heat Sinks
The ATS-13B-16-C2-R0 Thermal - Heat Sink is a type of heat-dissipating component, specifically designed for powerful electrical devices. These devices are used in a wide variety of applications, and they are renowned for their reliability and efficiency. This article aims to discuss the application fields and working principles of this type of thermal - heat sink.
Thermal - Heat Sinks are most commonly used in applications which require long-life, high-power electrical devices. Examples of such applications include the power circuits of industrial-grade robots, computers and other machines which require immense processing power. Devices like laser systems, semiconductors, LEDs, and industrial motors are also commonly used together with thermal - heat sinks.
In order to ensure that these powerful devices do not overheat, the application of a thermal - heat sink is necessary. As its name suggests, a heat sink is a device designed to absorb heat from a component or system. It accomplishes this by dissipating the heat to the surrounding environment. This heat is then transferred to the air through the heat-dissipating surface of the heat-sink. As the air surrounding the heat sink is cooler than the heat source, this process allows for the efficient dissipation of heat.
The ATS-13B-16-C2-R0 Thermal - Heat Sink is a highly-efficient heat-dissipating component. It is designed with a unique set of technologies which amplifies its air circulation and heat transfer capabilities. This includes its structural design which amplifies the air circulation by using double-sided micro air void technology. The ATS-13B-16-C2-R0 Heat Sink is also designed with a silver-nickel base material which helps to ensure the efficient transfer of heat.
The ATS-13B-16-C2-R0 Heat Sink is also designed with its own unique range of thermal parameters, specifically designed for the extremes found in industrial-grade devices. These include its maximum operating temperature of -40°C to 120°C, its thermal resistance of 0.3 ℃/W and its thermal resistance rate of 0.4W/mK. These thermal parameters ensure that powerful devices are able to work at their full capacity without fear of overheating.
The ATS-13B-16-C2-R0 Heat Sink is a highly reliable and efficient heat-dissipating component. Its high-performance capabilities and wide range of applications make it a valuable component for any power device. By providing an efficient heat-dissipating solution, it helps to ensure that devices are able to power at their full capacity without fear of overheating.
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