| Allicdata Part #: | ATS21933-ND |
| Manufacturer Part#: |
ATS-13B-17-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-17-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential part of thermal management in modern electronic applications. As the number of components used in a system grows, as the speed of operation increases and as the form factor of the components shrinks, thermal management becomes more important. The ATS-13B-17-C2-R0 heat sink is a key component for proper thermal management. This article will describe the application field and working principle of the ATS-13B-17-C2-R0.
The ATS-13B-17-C2-R0 is a type of extruded aluminum heat sink and is designed to dissipate heat from a variety of electronic components. It is a powerful and reliable heat dissipation solution for a wide variety of applications due to its efficient, durable design. This type of heat sink is especially useful for components that generate a lot of heat such as CPU and GPU processors, as well as other components that generate significant amounts of heat. The heat sink can also be used to cool memory chips, voltage regulators, power transistors, and other high-current components.
The ATS-13B-17-C2-R0 is designed to dissipate heat through a combination of convection, conduction, and surface radiation. It has a series of fins, each with rounded edges that allow for more efficient heatsinking and increased air-flow. The fins are designed to capture hotter air near the component and move it away, which helps to cool the component more quickly. The heat sink also has a unique fin design which includes a spiral patterned extrusion that allows for maximum heat transfer.
In addition, the ATS-13B-17-C2-R0 has a temperature controlled fan as part of its design. The fan helps maintain a safe operating temperature range for the cooling components. The fan works by taking in cooler ambient air and moving it over the fins, thus transferring the heat away from the component. The fan is controlled by a thermostat, which helps keep the fan from running at full speed when not necessary and helps to reduce the noise level.
The ATS-13B-17-C2-R0 is a high-performance, cost-effective heat sink solution. It is a very reliable solution for applications that require a strong and efficient thermal management system. The combination of its efficient design, temperature controlled fan, and robust construction make the ATS-13B-17-C2-R0 an ideal choice for many thermal management projects.
The specific data is subject to PDF, and the above content is for reference