| Allicdata Part #: | ATS21934-ND |
| Manufacturer Part#: |
ATS-13B-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
Heat sinks are an important part in any electronic system. Heat sinks dissipate heat by transferring the heat away from its source. Heat sinks are classified into four main categories; diffusive, dissipative, diffusive-dissipative and evaporative. Thermal – Heat Sinks fall into the diffusive-dissipative category. This classification is due to the fact that Thermal – Heat Sinks use both convection and radiation to dissipate heat.
Thermal – Heat Sinks are commonly used in computers and other electronics to efficiently dissipate the heat generated by these devices. ATS–13B–170–C2–R0 is one such Thermal – Heat Sink. This type of Heat Sink has been designed to dissipate primarily low power density applications, making it ideal for applications such as small motors, LED lighting, and low-power CPUs.
The working principle of the ATS–13B–170–C2–R0 Thermal – Heat Sink is that when it is exposed to a heat source, it radiates the thermal energy absorbed by the Heat Sink efficient away from its surface. This radiation is then diffused by the Heat Sink fins, which are specially designed to optimize the cooling efficiency of this type of Heat Sink. This allows the Heat Sink to effectively dissipate the thermal energy away from the heat source.
The ATS–13B–170–C2–R0 Thermal – Heat Sink is an effective and reliable solution for dissipating heat from low power density electronic components. Its design ensures that it performs efficiently during its usage, and that the heat source is able to operate at safe temperature levels. It is also important to note that the ATS–13B–170–C2–R0 Thermal – Heat Sinks have been tested to withstand extreme environmental temperatures, making them ideal for use in a variety of areas including the automotive and aerospace sectors.
In conclusion, Thermal – Heat Sinks are an effective solution for dissipating the heat generated by small, low-power electronic devices. The ATS–13B–170–C2–R0 Thermal – Heat Sink offers reliable performance and an efficient cooling solution for hot-running electronic devices. Its design allows it to diffuse heat efficiently away from its source, and its performance has been tested to withstand a variety of extreme environmental temperatures.
The specific data is subject to PDF, and the above content is for reference