| Allicdata Part #: | ATS-13B-184-C1-R0-ND |
| Manufacturer Part#: |
ATS-13B-184-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-184-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
The ATS-13B-184-C1-R0 is a thermal-transfer module specifically designed to dissipate heat from electronic equipment. It is an ultra-thin heat sink that supports thermal transfer with minimal extent, significantly increasing surface area to volume ratio and its associated performance.
The ATS-13B-184-C1-R0 manufacturing process begins with providing a sheet metal substrate. Depending on the design requirements, it can be abraded or heat-treated to achieve design-specific hardness. The substrate is then anodized and primed. The actual assembly process involves laser cutting to form the individual contact elements of the product. Afterward, holes are cut with a single-operation punch and the perimeter edges are simultaneously beveled. The product is then machined and the containing parts for thermal transfer attributes are fastened together.
Application Field
The ATS-13B-184-C1-R0 is most often used in the electronics industry, where it provides improved thermal transfer for industrial electronics. It is ideal for providing a high-efficiency surface layer which can be used to effectively dissipate heat. This may include a range of product applications within consumer electronics, such as computers, tablets, gaming consoles and other such devices. Additionally, it has also been used in many medical and military applications.
Working Principle
The working principle of ATS-13B-184-C1-R0 is based on enhanced thermal transfer. The process begins by applying heat from a source, such as an electrical component or a battery, to the ATS-13B-184-C1-R0 heat sink. The heat then gradually spreads throughout the heat sink as a result of the increased surface area to volume ratio. As the heat is dissipated from the center of the heat sink outward, it gradually cools, allowing the rate of heat transfer to remain constant. The heat is then spread throughout the environment, and the temperature in the immediate area is lowered.
Conclusion
The ATS-13B-184-C1-R0 is an ideal thermal transfer solution for a variety of electronic products but is most commonly used in consumer electronics. It features an ultra-thin form factor, improved surface area to volume ratio, and enhanced thermal transfer capabilities. Furthermore, its process of dissipating heat is conceptually simple, efficient, and effective.
The specific data is subject to PDF, and the above content is for reference