ATS-13B-185-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS21950-ND

Manufacturer Part#:

ATS-13B-185-C2-R0

Price: $ 4.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13B-185-C2-R0 datasheetATS-13B-185-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.10130
10 +: $ 3.99042
25 +: $ 3.76891
50 +: $ 3.54715
100 +: $ 3.32545
250 +: $ 3.10376
500 +: $ 2.88206
1000 +: $ 2.82664
Stock 1000Can Ship Immediately
$ 4.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.35°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The ATS-13B-185-C2-R0 is a type of heat sink designed especially for use in extreme thermal application fields. It is manufactured with a thin-fin dispersal design, resulting in increased cooling efficiency compared to traditional heat sink designs. This high performance feature makes the ATS-13B-185-C2-R0 ideally suited for applications which require fast and efficient heat dissipation.

The ATS-13B-185-C2-R0 is made with an aluminum alloy base and thin-fin wall structure, which allows efficient heat transfer from the internal components to the surrounding environment. To further enhance heat dissipation, the fins are oriented at a 45-degree angle to provide maximum surface area for the internal components to dissipate the heat. Additionally, a copper heat spreader plate is mounted on the top of the heat sink to help reduce the thermal resistance from the internal components to the heat sink surroundings.

The ATS-13B-185-C2-R0\'s unique design includes a special feature that makes the heat sink suitable for high power components: the fins are electroplated in a nickel-based plating process, which helps to protect the heat sink against oxidation and degradation from extended exposure to high temperatures. This plating process also gives the ATS-13B-185-C2-R0 the ability to absorb and dissipate heat quickly, resulting in improved reliability for the underlying circuit.

The ATS-13B-185-C2-R0 is designed for a variety of applications, such as power supply modules, DC/DC converters, RF amplifiers, high-power transistors, power semiconductor chips, data transmission devices, and similar components. It is ideal for applications where fast and efficient cooling is needed, such as in high-temperature environments. Additionally, the heat sink can be employed in applications which require low acoustic noise, as its design minimizes the amount of mechanical noise produced by the fans.

The ATS-13B-185-C2-R0 is an extremely efficient heat sink design that can be used in a variety of extreme thermal application fields. The base is manufactured using an aluminum alloy, which allows efficient heat dissipation. The thin-fin design, along with the nickel-based plating process, enable the heat sink to absorb and dissipate heat quickly and efficiently. The ATS-13B-185-C2-R0 is designed for applications which require fast and efficient cooling, as well as those which require low acoustic noise.

The specific data is subject to PDF, and the above content is for reference

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