| Allicdata Part #: | ATS-13B-192-C1-R0-ND |
| Manufacturer Part#: |
ATS-13B-192-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-192-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.The ATS-13B-192-C1-R0 is a thermal heat sink device used in the electronics industry, specifically within consumer products. It helps keep components such as processors, memory and hard drives cool and protected by dissipating the heat away from them. This heat sink can be found in many modern devices, from gaming systems to personal computers.
The ATS-13B-192-C1-R0 is a fanless, passively cooled heat sink, designed specifically for cost savings. The base plate material is aluminum, giving good thermal contact and effective heat transfer. The fin pattern has been designed to maximize the performance of the heat sink. The fins are arranged in a 4-pin pattern, with each fin having an optimized profiling to increase the thermal resistance. The mounting holes are placed around the perimeter of the base plate, so that the device can be securely attached to the application.
The actual operation of the heat sink is simple, but effective. When the components producing the heat are switched on, the heat generated is transferred to the base plate of the heat sink. The fins on the heat sink then draw out the heat and expel it into the atmosphere. The size of the heat sink determines how much heat can be dissipated before it reaches dangerous levels. Generally speaking, larger heat sinks will have a greater capacity to dissipate heat.
Although it is primarily used in consumer electronics, heat sinks can be found in many other applications as well. For example, they are commonly used in automobiles, as they help keep the engine cool and running efficiently. They can also be used in industrial applications, where they are used to dissipate large amounts of heat generated by the machinery. Some applications have even found them to be useful in keeping computers and other electronic devices cool when placed in hazardous environments, such as in an aircraft.
The ATS-13B-192-C1-R0 is a versatile heat sink device that can provide cost savings and good thermal management in many applications. Its aluminum base plate and optimized fin pattern make it an ideal choice for dissipating the heat produced by modern electronics.
The specific data is subject to PDF, and the above content is for reference