| Allicdata Part #: | ATS-13B-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-13B-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used to dissipate heat that is generated from a wide range of electronic devices, including microprocessors, power supplies, and circuit boards. The ATS-13B-197-C3-R0 thermal heat sink is a type of heat sink that is designed specifically for applications that require high levels of power dissipation. In this article, we will discuss the application field and working principle of the ATS-13B-197-C3-R0 thermal heat sink.
The ATS-13B-197-C3-R0 is a type of ray heat sink with a concentric fin design that is ideal for applications requiring high levels of power dissipation. The thermal heat sink includes a die-cast aluminum frame with high heat conductive fins, which provide an effective pathway for dissipating the heat. The fins are arranged in a concentric array, which provides efficient surface area for heat dissipation. The heat is dissipated through convection, where the air is circulated around the fins to reduce the temperature of the air inside the device.
The ATS-13B-197-C3-R0 thermal heat sink is designed to work in a wide range of applications. It can be used in CPUs, microprocessors, power supply applications, circuit boards, and power amplifier applications. The thermal heat sink is able to dissipate up to 400 Watts of power, which makes it suitable for the more demanding applications. The heat sink has an ultra-thin profile design which allows for a slim profile and a lighter weight, which makes the ATS-13B-197-C3-R0 easy to handle and install.
The ATS-13B-197-C3-R0 thermal heat sink works using the natural convection process, where the airflow is used to move the heat away from the device. The air flows around the fins which increases the surface area for cooling, which in turn increases the rate of heat transfer. The fins are arranged in a concentric array, which allows for a more effective heat dissipation. The improved design of the fin structure increases the efficiency of the heat dissipation process.
The ATS-13B-197-C3-R0 thermal heat sink is designed for applications that may require high levels of power dissipation. The device is easy to install and comes with a variety of mounting options, including a wall mount, ceiling mount, or table top mount. The slim profile design also makes the heat sink easy to install, and its lightweight construction makes it easy to move and install. The ATS-13B-197-C3-R0 thermal heat sink is designed to provide efficient and reliable cooling to any application.
In conclusion, the ATS-13B-197-C3-R0 thermal heat sink is a type of thermal heat sink which provides efficient heat dissipation for a wide range of electronic devices. The device is designed with an ultra-thin profile, which allows the heat sink to be installed with ease. The fins on the ATS-13B-197-C3-R0 are designed in a concentric array, which provides an effective surface area for heat dissipation. The ATS-13B-197-C3-R0 thermal heat sink is designed for a wide range of applications, including CPUs, microprocessors, power supply applications, circuit boards, and power amplifier applications, providing reliable and efficient cooling.
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