| Allicdata Part #: | ATS-13B-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-13B-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are engineered designs that employ radiative and convective modes of heat transfer to transfer thermal energy away from a hot surface, such as the case with ATS-13B-20-C3-R0. Heat sinks virtually always take the form of metal plates, and/or copper pins, through which cooling fluids, such as air or liquid, are circulated. ATS-13B-20-C3-R0 is a thermal heat-sink specifically designed to dissipate heat from a device such as a computer processor, microcontroller, power transistor, power MOSFET, IGBT module, or any other electronic component that generates a lot of heat when operated.
ATS-13B-20-C3-R0 is designed to dissipate heat from electronic components in industrial machinery, telecommunications, computer peripherals and other electronic equipment. It features an innovative design with 100% copper construction, a heat dissipating pin array and anodized aluminum heat sink fins to maximize heat dissipation. Heat is efficiently dissipated due to the surface increasing area of the fins which increases boundary layer convection. The design also includes anode sealed-in fins, which further increase thermal performance.
The working principle of ATS-13B-20-C3-R0 is based on the natural laws of thermodynamics, in particular the law of conservation of energy and the three laws of heat transfer: conduction, convection, and radiation. Heat generated by the device is transferred via the thermal heat-sink from its components through multiple pathways of heat transfer. The multiple pathways used to transfer the heat include conduction, which requires a solid material connection between the device and the heat sink, convection, in which thermal energy is circulated through a fluid such as air or liquid, and radiation, which is a method of heat transfer through space in the form of electromagnetic waves. All these pathways allow the device to dissipate maximum heat through the ATS-13B-20-C3-R0.
In conclusion, ATS-13B-20-C3-R0 is a type of specialty heat-sink designed for transferring thermal energy away from a hot surface and dissipating it to the environment in order to prevent the component from overheating. It utilizes conduction, convection, and radiation to transfer thermal energy from the device to the environment. The innovative design of the ATS-13B-20-C3-R0 further increases its thermal performance and makes it ideal for use in systems with high thermal loads.
The specific data is subject to PDF, and the above content is for reference