| Allicdata Part #: | ATS21967-ND |
| Manufacturer Part#: |
ATS-13B-200-C2-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-200-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.56580 |
| 10 +: | $ 3.47004 |
| 25 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are a type of cooling device that is used to maximise the dissipation of heat in electronic components. The ATS-13B-200-C2-R0 heat sink is a high performance model specifically designed for the purpose of effectively cooling high performance components. The heat sink is especially well-suited to powering applications that require increased amounts of power, such as telecommunications equipment and high-end servers.
The ATS-13B-200-C2-R0 heat sink features a premium design with a dual pin fin construction combined with an aluminium alloy material structure. This specialised construction provides increased surface area, ensuring maximum conductivity between the heat source and the heat sink base. In addition to this, the ATS-13B-200-C2-R0 also features a heat-pipe and extruded fin designs which provide superior thermal performance. The heat sink is capable of dissipating up to 200 watts of energy and can operate at temperatures ranging from -40 to +85°C.
The ATS-13B-200-C2-R0 heat sink’s basic working principle is based on the principle of convection. The heat generated by the component is conducted away from the component and is absorbed by the aluminium alloy fins of the heat sink. This heat is then dissipated into the environment due to the greater surface area of the fins. The heat-pipe construction of the ATS-13B-200-C2-R0 heat sink further enhances the cooling efficiency of the device, allowing for faster heat absorption and dissipation.
One of the primary applications of the ATS-13B-200-C2-R0 heat sink is in high performance components such as processors and GPUs in computers, printers, and servers. It is also used in power amplifiers and other power-consuming components required for telecommunications applications. Due to its aluminium alloy construction and heat-pipe design, the ATS-13B-200-C2-R0 provides superior cooling performance compared to other heat sinks in its range. Its slim and light-weight design also ensures that it is well suited for use in tight spaces.
Overall, the ATS-13B-200-C2-R0 heat sink provides an effective cooling solution for high performance components. It is made from premium materials which provide superior thermal performance as well as an elegant design. Its slim and light-weight design also ensures that it is well suited for use in tight spaces.
The specific data is subject to PDF, and the above content is for reference