| Allicdata Part #: | ATS-13B-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-13B-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an essential element in the continuous improvement of modern technology. Heat sinks are widely used to dissipate heat in electronics, electrical systems, and industrial machinery. The ATS-13B-32-C2-R0 is a type of thermal heat sink designed for exceptional heat transfer performance. This article looks at the application field and working principle of the ATS-13B-32-C2-R0.
The ATS-13B-32-C2-R0 thermal heat sink is mainly used for applications in tight spaces or where heat must be effectively spread to a number of heat sources. Examples include server cabinets, control panels, telecommunications equipment, medical equipment, network equipment, and household appliances. Additionally, the thermal heat sink is ideal for applications involving short distances between multiple heat sources. The ATS- 13B-32-C2-R0 is designed to provide maximum transfer of heat while also providing a compact footprint.
Thermal heat sinks are a common form of thermal management. The ATS-13B-32-C2-R0 works by transferring thermal energy away from a heat-producing component like a processor or an IC chip. An aluminum body is used to provide efficient heat transfer. The heat-dissipating fins are designed to increase the surface area and facilitate the conduction of heat away from the source. The ATS-13B-32-C2-R0 also uses a number of air vents designed to be spread out so that air can flow freely and aid in the transfer of heat.
The ATS-13B-32-C2-R0 thermal heat sink also boasts a number of features designed to enhance usability. Included is a clip-on retention option that allows the heat sink to be quickly and easily mounted on components. Additionally, the ATS-13B-32-C2-R0 features quick-change fan hardware, meaning that users are able to easily and quickly install and remove the fan.
The ATS-13B-32-C2-R0 thermal heat sink is an excellent choice for dissipating heat in environments with limited space or high heat production. It features excellent thermal performance, a lightweight design, and quick-change mounting and removal features. Additionally, the ATS-13B-32-C2-R0’s aluminum construction and air vents ensure effective heat transfer.
The specific data is subject to PDF, and the above content is for reference