| Allicdata Part #: | ATS-13B-33-C1-R0-ND |
| Manufacturer Part#: |
ATS-13B-33-C1-R0 |
| Price: | $ 5.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-33-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.86990 |
| 30 +: | $ 4.59900 |
| 50 +: | $ 4.32860 |
| 100 +: | $ 4.05802 |
| 250 +: | $ 3.78748 |
| 500 +: | $ 3.51695 |
| 1000 +: | $ 3.44932 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13B-33-C1-R0 is a thermal heat sink device used to dissipate heat away from a system and keep it functioning. This type of heat sink is commonly found in servers or other electronic equipment where high performance components generate a large amount of heat, making traditional air cooled solutions inadequate. The ATS-13B-33-C1-R0 is designed to be mounted onto the system board, which channels the heat away from the circuit and into the environment.
The ATS-13B-33-C1-R0 uses a printed circuit board (PCB) to transfer the electronic heat to different parts of the device. The PCB contains multiple layers of heat-conducting material and is attached to the system board by either heat or pressure. The PCB then transfers the heat from the system board to the various layers of the device. Each layer of the device is designed to absorb and dissipate the heat, with the outermost layer having a larger surface area than the rest so that more heat can be absorbed and dissipated more quickly.
The ATS-13B-33-C1-R0 also uses thermoelectric cooling to take heat away from the system board. This involves transferring the thermal energy of one element to the other element, thus cooling one side while heating the other. The thermoelectric cooling plate includes one side that is powered by an electric charge, and the other side is cooled by the air or other cooling medium. The thermoelectric cooling plate allows for efficient heat transfer and better cooling performance in comparison to traditional cooling methods.
The ATS-13B-33-C1-R0 is capable of dissipating up to 95 watts of heat. It is designed to be mounted onto the system board, and it also includes a mounting bracket to ensure a secure fit. In addition, it is designed for easy installation and it also comes with all necessary hardware included for easy setup.
The ATS-13B-33-C1-R0 has a wide range of applications, such as servers, PCs, laptop computers, and other electronic systems. The device is designed for a maximum cooling performance of 95 watts, making it an ideal choice for systems that require high levels of cooling. Additionally, the device is designed for easy installation and comes with all necessary hardware for a secure fit.
Overall, the ATS-13B-33-C1-R0 is a reliable and efficient thermal heat sink designed to keep a system at optimal temperature. It utilizes thermoelectric cooling to transfer heat from the system board and keep it functioning properly. The device is capable of dissipating up to 95 watts of heat, making it an ideal choice for applications that require a high level of cooling. It is also designed for easy installation and comes with all the necessary hardware for a secure fit.
The specific data is subject to PDF, and the above content is for reference