| Allicdata Part #: | ATS-13B-64-C1-R0-ND |
| Manufacturer Part#: |
ATS-13B-64-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-64-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are used for dissipating heat from electrical and electronic components and assemblies to improve their reliability and performance. ATS-13B-64-C1-R0 is a type of thermal-heat sink designed for managing high heat flux applications. This article will discuss the application field and working principle of ATS-13B-64-C1-R0.
Application Field of ATS-13B-64-C1-R0
ATS-13B-64-C1-R0 is specifically designed for power electronic applications such as power supply, inverters or other high power electrical devices, particularly those with higher heat fluxes. This thermal-heat sink is made from a high-performance aluminum alloy with an inner core layer to provide excellent heat dissipation and low thermal resistance. It is also designed with an electroplating layer to facilitate corrosion resistance and strong adhesion.
Additionally, the ATS-13B-64-C1-R0 has a surface mount end feature, allowing it to be mounted directly onto PCBs without any additional hardware. This makes the assembly process much easier and more efficient. In addition, the low thermal resistance of the thermal-heat sink ensures reliable cooling performance to help reduce the temperatures of sensitive components and guarantee maximum power efficiency.
Working Principle of ATS-13B-64-C1-R0
The ATS-13B-64-C1-R0 thermal-heat sink works by dissipating the heat generated by electrical and electronic components. Heat is dissipated through the convection process, where the heat is conducted from the components to the surface of the sink and then dissipated to the ambient air. The higher the ambient air temperature, the more efficiently the heat can be dissipated.
The ATS-13B-64-C1-R0 also utilizes a high-performance aluminum alloy and an inner core layer to provide efficient heat dissipation and low thermal resistance. This helps to maximize power efficiency and reduce temperatures of sensitive components. Additionally, the electroplating layer facilitates corrosion resistance and strong adhesion.
Conclusion
The ATS-13B-64-C1-R0 thermal-heat sink is a high-performance design that is specifically designed for power electronic applications. It is made from a high-performance aluminum alloy with an inner core layer to provide efficient heat dissipation and low thermal resistance. Furthermore, the surface mount end feature allows the sink to be mounted directly onto PCBs without additional hardware. Finally, the heat is efficiently dissipated to the ambient air through the convection process, helping to reduce temperatures of sensitive components and maximize power efficiency.
The specific data is subject to PDF, and the above content is for reference