ATS-13B-72-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13B-72-C1-R0-ND

Manufacturer Part#:

ATS-13B-72-C1-R0

Price: $ 4.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13B-72-C1-R0 datasheetATS-13B-72-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.99042
30 +: $ 3.76887
50 +: $ 3.54715
100 +: $ 3.32545
250 +: $ 3.10376
500 +: $ 2.88206
1000 +: $ 2.82664
Stock 1000Can Ship Immediately
$ 4.43
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.09°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks encompass a wide range of equipment designed to protect and prevent overheating of objects, mainly electronic components, but also mechanical, optical or other equipment. Heat Sinks are usually made of a metallic or alloy material, either aluminum or copper, and have a series of radiating fins or other shapes to increase the exposed surface area to surrounding air. Heat Sinks may be passively or actively cooled, and are vital to the proper functioning of a myriad of applications.

ATS-13B-72-C1-R0 Application Field

The ATS-13B-72-C1-R0 is a 1U-sized passive aluminum heat sink designed to be used in a variety of applications. It uses thermal conductivity and a series of fins to dissipate heat away from components or systems, slowing down thermal degradation of the components and preventing overheating. The ATS-13B-72-C1-R0 can be used in any application where cooling is needed due to high levels of thermal energy, and can fit in a variety of boards, chassis, and other spaces. The ATS-13B-72-C1-R0 is particularly suitable for applications such as industrial automation, computer server boards, telecoms and networking, LED lighting, storage systems, embedded systems, and video systems.

ATS-13B-72-C1-R0 Working Principle

The ATS-13B-72-C1-R0 works by dissipating heat from an object or system by using airflow in combination with an LED-finned aluminum-composite heat sink. Heat naturally rises, and the heat sink’s surface area provides a greater surface area for the heat to transfer to the surrounding air. The venting fins on the edge of the heatsink are angled in order to increase airflow, allowing more heat to escape the heat sink than would be possible with a flat heatsink. The fins also provide additional surface area that the heat can travel across as it moves away from the hot components, preventing hotspots and allowing the heatsink to cool more efficiently.

Additionally, the ATS-13B-72-C1-R0 is designed to be compatible with hardware such as heatsinks and cooling fans, which can be used to further optimize heat dissipation. Fans help move hot air away from the heatsink, ensuring that the finned surface area remains intact and providing greater cooling in cramped or tight areas where airflow may be restricted. In applications where more cooling is needed, such as larger server boards, the ATS-13B-72-C1-R0 can be fitted with additional heatsinks or fans.

Conclusion

The ATS-13B-72-C1-R0 heat sink is a reliable, versatile and compact passive heatsink, designed for a wide variety of applications. With its finned surface area and compatibility with other cooling hardware, the ATS-13B-72-C1-R0 can provide optimal cooling for electronics and can keep them running cooler and longer. Heat Sinks such as the ATS-13B-72-C1-R0 are essential to get the most out of the components, avoid overheating and make sure electronics runs safely and reliably.

The specific data is subject to PDF, and the above content is for reference

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