| Allicdata Part #: | ATS22019-ND |
| Manufacturer Part#: |
ATS-13B-74-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13B-74-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of today’s electronic products, and heat sinks play a pivotal role in this process. ATS-13B-74-C2-R0 is an ideal heat sink for many electronics applications.
The ATS-13B-74-C2-R0 is a heat sink made of aluminum and designed to effectively dissipate heat away from hard-working electronics. It is designed to integrate easily into your application and to provide the ultimate in heat dissipation, without needing any additional accessories or components.
The design of the ATS-13B-74-C2-R0 is simple but effective. The heat sink consists of a base plate that is made of finned aluminum and a metal top plate. The fin design of the aluminum base provides for air flow to and from the top plate, thereby allowing for an optimal level of air cooling. The metal top plate is then attached to the base plate with screws, and is also fitted with a thermal pad, which helps to transfer heat away from the electronics system.
With the ATS-13B-74-C2-R0, heat generated by your electronics is quickly transferred away from the system and dispersed into the air. This heat sink also provides enhanced thermal flow, which allows the system to run cooler and more efficiently. In addition, the design of the ATS-13B-74-C2-R0 makes it perfect for use in tight spaces and applications where space is at a premium.
The ATS-13B-74-C2-R0 is a perfect choice for a wide range of applications, including heat-sensitive components such as laser diodes, transistors, and LED lighting. It is also suitable for a variety of surface mount devices such as power resistors, TO-220 packages, and PDIP packages. The ATS-13B-74-C2-R0 can even be used in applications where a fan-less cooling solution is desired.
In addition, the ATS-13B-74-C2-R0 is designed to withstand a wide range of thermal conditions, from -40°C to 150°C. The design of the ATS-13B-74-C2-R0 also allows for superior thermal resistance, which means it can dissipate thermal energy more efficiently and reduce or eliminate hot spots.
The ATS-13B-74-C2-R0 is a reliable and efficient heat sink that can be utilized in a variety of applications. It offers optimal thermal efficiency and is designed to withstand a wide range of temperatures, making it an ideal choice for electronics designs.
The specific data is subject to PDF, and the above content is for reference